2018
DOI: 10.1016/j.ijheatmasstransfer.2017.10.065
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Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

Abstract: The present paper covers the comparison of two different configurations (square and circular) pinfin heat sinks embedded with two different phase change materials (PCMs) namely paraffin wax and n-eicosane having different thermo-physical properties were carried out for passive cooling of electronic devices. The pin-fins, acting as thermal conductivity enhancers (TCEs), of 2 square and 3 circular fin thickness of constant volume fraction of 9% are chosen and input heat fluxes from 1.2 / 2 to 3.2 / 2 with an inc… Show more

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Cited by 193 publications
(52 citation statements)
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“…Thus, a PCM with higher latent-heat and thermal conductivity with stable chemical structure is the most suitable. To overcome this issue, researchers have introduced several heat transfer enhancement techniques including extruded metal-fins [12,13,14,15,16,17], metal-foam and porous materials [18,19], nanomaterials [20,21,22] encapsulated micro/nano-capsules [23,24,25,26].…”
Section: Introductionmentioning
confidence: 99%
“…Thus, a PCM with higher latent-heat and thermal conductivity with stable chemical structure is the most suitable. To overcome this issue, researchers have introduced several heat transfer enhancement techniques including extruded metal-fins [12,13,14,15,16,17], metal-foam and porous materials [18,19], nanomaterials [20,21,22] encapsulated micro/nano-capsules [23,24,25,26].…”
Section: Introductionmentioning
confidence: 99%
“…In fact, the miniaturization of electronic components causes an increase in their working temperature and subsequently the challenge of cooling them 1 . To overcome this challenge, phase change materials (PCMs) are integrated in heat sinks for latent heat storage 2,3 . These PCMs are integrated in numerous fields of applications like the thermal regulation of the building, 4 the thermal regulation of agricultural greenhouses 5 .…”
Section: Introductionmentioning
confidence: 99%
“…The lower thermal conductivity of OPCMs reduces the rate of heat transfer, which causes increase in temperature gradient and insensitivity to temperature changes across the system boundaries. OPCMs, with potential advantage as TES materials, are being developed for applications including air conditioning, ie, natural air cooling, cold thermal storage and absorption refrigeration, waste heat recovery, solar energy storage, thermal regulating fabric, passive heating of building, heat pipes, desalination, thermal management of electronic devices and electric vehicle batteries, spacecraft, and other integrated thermal control systems such as trombe wall, PCM‐filled wallboards, shutter, concrete, under floor heating systems, ceiling boards, and hot water supply . However, the leakage issue and lower thermal conductivity of OPCMs causes harm with interacting medium and results in energy efficiency losses of the thermal system.…”
Section: Introductionmentioning
confidence: 99%