Thermal Measurement and Modeling of Multi-Die Packages

Poppe, A.; Zhang, Yan; Wilson, John P.; Farkas, G.; Szabó, Péter; Parry, John; Rencz, M.; Székely, V.

doi:10.1109/tcapt.2008.2004578

Cited by 87 publications

(24 citation statements)

References 11 publications

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“…[6,24]. On the level of the discretized model of a system, however, where every heat-source and every monitoring location is point-like, the network model is completely reciprocal, therefore distinction in naming the two nodes associated with ″input″ and ″output″ side of a thermal transfer impedance (transfer function) is not necessary, we simply call these terminal nodes as ports.…”

Section: Sunred Algorithm With Transfer Functions Representing Thermamentioning

confidence: 99%

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Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Németh

Poppe

2018

Period. Polytech. Elec. Eng. Comp. Sci.

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In this paper we present a new, direct computational method for calculating thermal transfer impedances between two separate locations of a given physical structure, aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm.We tested the method symbolically with a simple 2D example with multiple combinations of Dirichlet and Neumann type boundary conditions. Also, for time domain transient analysis different types of thermal loads such as prescribed unit-step change in dissipation or temperature were assumed. A model of a typical MCPCB assembled LED was also created. With that model we studied the inverse problem of predicting the thermal conditions at the junction (the "driving point") from the transient signal measured at the thermal test point on the MCPCB (the "monitoring point") which is a typical task in simple LED thermal management designs. Results obtained by the proposed new calculation method and results obtained by conventional numerical simulations differ less than the uncertainty of the traditional solution method itself. The drawback of the accuracy is the high computational cost. This increased computational need can be mitigated by introducing the combination of the balanced model reduction and the SUNRED algorithms. Keywords

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Section: Sunred Algorithm With Transfer Functions Representing Thermamentioning

confidence: 99%

“…despite some efforts aimed at modeling stacked die IC packages [6] the lack of ability of describing multi-heat source packages. Another problem of the DELPHI model is that it is a steady-state model.…”

Section: Introductionmentioning

confidence: 99%

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Németh

Poppe

2018

Period. Polytech. Elec. Eng. Comp. Sci.

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“…During the last decades, significant results have been achieved in terms of construction of Dynamic Compact Thermal Models (DCTMs) of electronic components and packages [1], [2].…”

Section: Introductionmentioning

confidence: 99%

Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources

Codecasa

Magnani

d’Alessandro

et al. 2016

2016 32nd Thermal Measurement, Modeling &Amp; Management Symposium (SEMI-THERM)

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A novel Model Order Reduction approach for the construction of Dynamic Compact Thermal Models is presented. With respect to previous approaches, this methodology allows reducing the complexity of the constructed models, from quadratically to linearly dependent on the number of independent heat sources. In such a way, the approach allows constructing Dynamic Compact Thermal Models practically without limitations on the number of heat sources. The proposed methodology is validated through the application to two state-of-the-art electronic systems.

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“…Usually the matrix is extracted either from experimental measurements [14], [15] or by refined three-dimensional thermal simulations. Alternative extraction methods based on Finite Difference Methods (FDM) are quite diffused in literature [15] and some of them exploit Model Order Reduction (MOR) methods together with Generalized Minimized Residual (GMRES) algorithms for solving heat equations [17]. Among the refined three-dimensional simulation techniques, the numerical computation approach through Finite Element Methods (FEMs) is the most diffused [18].…”

Section: Introductionmentioning

confidence: 99%

Electrothermal PSpice Modeling and Simulation of Power Modules

Raciti

Cristaldi

Greco

et al. 2015

IEEE Trans. Ind. Electron.

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Integrated Power Electronics Modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEMs usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electro-thermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electro-thermal multi-domain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multi-physics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic design automation (EDA) flow, is presented. Besides, we describe the validation procedure of the proposed approach and the results are compared with the ones obtained by a commercial finiteelement-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.

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Thermal Measurement and Modeling of Multi-Die Packages

Cited by 87 publications

References 11 publications

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources

Electrothermal PSpice Modeling and Simulation of Power Modules

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