Thermal, Mechanical and Dielectric Properties of Silicon Carbide/Polyphenylene Sulfide Composites

Abstract

The functionalized silicon carbide (SiC) fillers are employed to fabricate silicon carbide/polyphenylene sulfide (PPS) composites by mechanical ball milling-compression molding method. The thermal conductive coefficient of the SiC/PPS composites with 40 wt% functionalized SiC is 0.934 W/ mK, 4 times higher than that of the original PPS. The mechanical properties of SiC/PPS composites are optimal with 5 wt% addition of SiC. Both the heat resistant and dielectric properties of the SiC/PPS composites are increased with the increasing addition of SiC. For a given SiC loading, the surface functionalization of SiC can improve the thermal conductivities and mechanical properties of the SiC/PPS composites simultaneously.

Thermal behavior and dielectric response of epoxy–boron nitride composites reinforced with short human hair fiber

“…[11][12][13] Earlier, many researchers have tried to improve the conductivity of the polymer with the incorporation of various types of traditional carbonaceous [14,15] (e.g., carbon black, graphite particulate) and metallic [16][17][18] (e.g., aluminum, copper, nickel) fillers. Some other researchers have also concentrated on composites with different types of potential ceramic fillers such as aluminum nitride (AlN), [19,20] alumina (Al 2 O 3 ), [21,22] silicon carbide (SiC), [23,24] and silicon nitride (Si 3 N 4 ). [25,26] Addition of these fillers substantially enhanced the thermal conduction behavior of the composite while mechanical properties as well as electrical insulation behavior of the composite have been severely deteriorated.…”