Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application

Fang, Haoming; Bai, Shu‐Lin; Wong, C.P.

doi:10.1016/j.compositesa.2017.04.018

Cited by 162 publications

(76 citation statements)

References 39 publications

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“…[28] This further indicates that the quality of BNNT dispersion is consistent between low and high BNNT content samples. Furthermore, the observed enhancement in Y is consistent with or outperforms modulus enhancement achieved by incorporating carbon nanotubes (66% at 5 wt%) [24] and boron nitride nanosheets (175% at 10 wt%) [29] into other soft polymers indicating our facile dispersion method is capable of producing high-quality BNNT/PDMS composites.…”

supporting

confidence: 75%

Tunable Piezoelectricity of Multifunctional Boron Nitride Nanotube/Poly(dimethylsiloxane) Stretchable Composites

et al. 2020

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Multifunctional piezoelectric materials with controllable mechanical and thermal properties could enable the next generation of soft interconnect materials, energy harvesters, and health monitors. [1] Boron nitride nanotubes (BNNTs) possess unique properties that have piqued the interest of the broader research community as the basis for these multifunctional materials. [2] BNNTs exhibit high mechanical strength, possessing a Young's modulus (Y) as high as 1.3 TPa [3] which outperforms most structural materials. BNNTs also show enhanced thermal properties including extreme thermal stability in air (>800 °C) [4] and thermal conductivity competitive with carbon nanotubes (CNT) [5] which, when combined with their electrically insulating nature, may enable the development of novel thermally conductive, electrically insulating materials. [6] Of particular interest are BNNTs' piezoelectric properties, [7] arising from polarization due to the electronegativity difference between boron and nitrogen atoms, which is predicted to result in the generation of a coupled electric dipole in response to deformation. [8] With the advent of techniques to produce large volumes of BNNTs such as the high temperature pressure (HTP) method, [9,10] interest has shifted to production of ensembles of BNNTs which translate the nanoscale properties of BNNTs to macroscale systems. The most widely employed technique to produce functional structures of BNNTs is suspension in a matrix material to form a functional composite. For instance, the dispersion of BNNTs in soft polymers has been shown to augment mechanical properties, nearly doubling the compressive modulus of polyurethane. [11] Similarly, BNNTs can be added to thermally insulating materials to enhance thermal conductivity, with addition of BNNTs to polymer-derived ceramic (PDC) enhancing thermal conductivity by 2100%. [12] Most saliently, BNNT/polymer composites represent the first realization of BNNT piezoelectricity at the macroscale. Polyimide composites containing strainaligned BNNTs demonstrate piezoelectric coefficients up to 4.81 pm V −1 , [13] and nanoporous BNNT thin films are predicted to possess piezoelectric responses competitive with commercial piezoelectric polymers. [14] Of particular interest are stretchable BNNT composites which are optimal for use as flexible thermal interconnects [15] and platforms for strain aligning nanotubes [16] Boron nitride nanotubes (BNNT) uniformly dispersed in stretchable materials, such as poly(dimethylsiloxane) (PDMS), could create the next generation of composites with augmented mechanical, thermal, and piezoelectric characteristics. This work reports tunable piezoelectricity of multifunctional BNNT/PDMS stretchable composites prepared via co-solvent blending with tetrahydrofuran (THF) to disperse BNNTs in PDMS while avoiding sonication or functionalization. The resultant stretchable BNNT/PDMS composites demonstrate augmented Young's modulus (200% increase at 9 wt% BNNT) and thermal conductivity (120% increase at 9 wt% BNNT) without losin...

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supporting

confidence: 75%

Tunable Piezoelectricity of Multifunctional Boron Nitride Nanotube/Poly(dimethylsiloxane) Stretchable Composites

et al. 2020

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“…Approving dielectric and insulation properties are of critical significance for electronic packaging material . For instance, low dielectric constant of material is beneficial to reduce attenuation and accelerate transmission speed of electronic signal . In this work, dielectric properties and electrical conductivities of pure PMIA and PMIA/fBNNSs nanocomposites were researched by employing broadband dielectric spectrometer, and results are exhibited in Figure .…”

Section: Resultsmentioning

confidence: 99%

“…[44,45] For instance, low dielectric constant of material is beneficial to reduce attenuation and accelerate transmission speed of electronic signal. [46] In this work, dielectric properties and electrical conductivities of pure PMIA and PMIA/fBNNSs nanocomposites were researched by employing broadband dielectric spectrometer, and results are exhibited in Figure 8. As can be seen from Figure 8a that the dielectric constants of all tested samples are slightly decreased with increasing frequency, and the higher content of fBNNSs, the larger dielectric constant values of PMIA/fBNNSs nanocomposite.…”

Section: Dielectric Properties and Electrical Conductivities Of Pmia/mentioning

confidence: 99%

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Duan

Wang

et al. 2019

Macro Materials & Eng

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Dielectric polymer‐based composites with high breakdown strengths and thermal conductivities have attracted considerable attention when applied in electronic devices. In this study, a novel poly(m‐phenyleneisophthalamide) (PMIA) dielectric nanocomposite is successfully fabricated by introducing functionalized hexagonal boron nitride nanosheet (fBNNS) fillers. Due to effective functionalization of hexagonal boron nitride nanosheets (BNNSs), fBNNSs fillers are homogeneously dispersed in the PMIA matrix. The breakdown strength and thermal conductivity of PMIA/fBNNSs dielectric nanocomposite are investigated. Research results indicate that the breakdown strength of fBNNSs‐12 reaches 105.6 MV m−1, which is 1.34 times that of pure PMIA. Moreover, owing to high thermal conductivity of fBNNSs, the thermal conductivities of fBNNSs‐12 are observably increased to 8.06 W m−1 K of in‐plane direction and 0.84 W m−1 K of through‐plane direction, respectively. Considering these properties, the manufactured PMIA/fBNNSs dielectric nanocomposites show potential applications in field of electronics.

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“…Heat management is one of the most crucial challenges in recent microelectronic technology as power density of electronic devices is rapidly increasing due to miniaturization and integration of such devices. [1] Also, it operates at high frequency and high power condition where large heat flux generated. For better performance of the devices, the efficient removal of accumulated heat is essential to maintain device efficiency and longer lifespan.…”

Section: Introductionmentioning

confidence: 99%

Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites

Agrawal

Chandrakar

2019

Polymer Composites

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Physical, mechanical, thermal, and dielectric behavior of surface modified hexagonal boron nitride (hBN) in epoxy matrix was investigated in this paper. Effective treatment of microsize boron nitride involved silane coupling agent, (γ‐aminopropyl)triethoxysilane such that the coating resulted from the treatment amounted to 2% of the weight of silane coupling agent of the treated BN. The present work revealed that the chemical treatment of BN surface could effectively enhance the adhesion between matrix and filler material. The dispersion and wettability of the BN powder in epoxy matrix after surface treatment were improved. These imparted improved physical and excellent mechanical and thermal properties to the developed material. The experimental study on thermal properties of fabricated composites indicated that incorporation of modified particles exhibits improved glass transition temperature. As filler loading increases, coefficient of thermal expansion of composite decreases which further decreases when treated filler were used. Further, appreciable improvement in thermal conductivity is obtained when treated hBN is used in place of untreated one. The dielectric properties are investigated for wide frequency range and filler content and found to be increased with hBN content and decrease with frequency enhancement. Furthermore, mechanical properties of such composites were also largely enhanced when treated fillers were used. With modified properties, the presently developed material is suitable for microelectronic applications.

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Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application

Cited by 162 publications

References 39 publications

Tunable Piezoelectricity of Multifunctional Boron Nitride Nanotube/Poly(dimethylsiloxane) Stretchable Composites

Tunable Piezoelectricity of Multifunctional Boron Nitride Nanotube/Poly(dimethylsiloxane) Stretchable Composites

Novel Poly(m‐phenyleneisophthalamide) Dielectric Composites with Enhanced Thermal Conductivity and Breakdown Strength Utilizing Functionalized Boron Nitride Nanosheets

Influence of particulate surface treatment on physical, mechanical, thermal, and dielectric behavior of epoxy/hexagonal boron nitride composites

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