2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2012
DOI: 10.1109/siitme.2012.6384381
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Thermal modeling of through hole capacitors

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Cited by 6 publications
(3 citation statements)
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“…From the research aspect, thermal modeling and lifetime prediction methods are proposed to obtain the health status of capacitors. For example, the physical structure of the capacitor is built to acquire the thermal model of capacitors [24][25][26][27][28][29]. Mission profile based evaluation method is proposed for lifetime prediction by accumulating damage from long-term loading profile [13,30].…”
Section: Introductionmentioning
confidence: 99%
“…From the research aspect, thermal modeling and lifetime prediction methods are proposed to obtain the health status of capacitors. For example, the physical structure of the capacitor is built to acquire the thermal model of capacitors [24][25][26][27][28][29]. Mission profile based evaluation method is proposed for lifetime prediction by accumulating damage from long-term loading profile [13,30].…”
Section: Introductionmentioning
confidence: 99%
“…The research on thermal stress analysis about capacitor is mainly divided into mathematical models and physical models. In terms of mathematical models, a model for quickly estimating the hot spot temperature of the single capacitor is established in [17]. For applications with multiple capacitors, the thermal stress of the capacitor banks is discussed by establishing a convective and radiative heat transfer model in [18].…”
Section: Introductionmentioning
confidence: 99%
“…From the capacitor end-user perspective, the effort of overcoming the challenges can be divided into three categories which are reviewed in this paper: ①Electrothermal-lifetime modeling to support model-based sizing of capacitors [10][11][12][13][14][15] ; ② Multi-objective optimization of passive capacitor banks in terms of cost, size, efficiency, and reliability [16][17][18][19] ; ③New capacitor concepts based on active switching circuits [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35] . The first effort is an analysis tool to predict the reliability performance of the capacitive DC links.…”
Section: Introductionmentioning
confidence: 99%