2017 21st European Microelectronics and Packaging Conference (EMPC) &Amp; Exhibition 2017
DOI: 10.23919/empc.2017.8346849
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Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Abstract: Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is … Show more

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Cited by 6 publications
(4 citation statements)
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“…Multiple melting/solidifying cycles of the prepared PCM during long−term operation is requirement to verify the long−term stability and durability for at least 5,000 cycles (Maxa et al., 2017). Thus, the thermal stability analyses of the composite PCM to store latent heat continued from Nov 8, 2018 for 14 consecutive days or 14 charging/discharging cycles.…”
Section: Resultsmentioning
confidence: 99%
“…Multiple melting/solidifying cycles of the prepared PCM during long−term operation is requirement to verify the long−term stability and durability for at least 5,000 cycles (Maxa et al., 2017). Thus, the thermal stability analyses of the composite PCM to store latent heat continued from Nov 8, 2018 for 14 consecutive days or 14 charging/discharging cycles.…”
Section: Resultsmentioning
confidence: 99%
“…[139] (ii) Modern synthesis tools, characterization tools, measurement tools, and so on must be investigated in order to use the proper complications and the targeted solution for those complications effectively. [140,141] (iii) Aside from the growing interest in improving the power factor of thermoelectric materials, the mechanical properties of the new generation of emerging thermoelectric materials and composites are receiving special attention. [142][143][144] Efforts should also be directed toward developing new designs of flexible thermoelectric devices and investigating potential applications, leveraging advantages such as mechanical flexibility while offsetting disadvantages such as low efficiency.…”
Section: Aircraftmentioning
confidence: 99%
“…Additionally, the latent heat PCMs show higher heat storage density than that of the sensible heat PCMs. Hence, latent heat storage using PCMs can satisfy the high-performance thermal energy storage requirements for different application areas such as advanced cooling packaging, 1 solar domestic hot water systems, 2 solar-powered air-cooling systems, 3 household refrigerating, 4 energy conservation buildings, 5 thermal management of electronics, 6 phase-change fibers, 7 and so on.…”
Section: Introductionmentioning
confidence: 99%