Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

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Power electronics is a key technology for the advancement and spreading of electromobility applications and compact power supply devices on the market. The use of new WBG semiconductors (e.g. SiC, GaN) as well as highly integrated silicon-based power electronics enables a significant increase in power density with increasing integration. At the same time, however, this development requires costly thermal management solutions, since the power semiconductors generate considerable heat loss during operation. To ensure the robustness of the systems, the components must be protected from critical temperatures. Nowadays, a considerable effort for active and passive cooling by fans, microfluidic systems or heat pipes is operated. Compared with that, the usage of phase change materials (PCM) is a novel approach for sophisticated thermal management [1], [2]. In this paper some selected results of research project SWE-eT (Heat-retaining coatings for next-generation, efficient, compact power electronics) funded as part of KomroL program (Compact and robust power electronics of the next generation) of German Federal Ministry of Education and Research are presented. Main goal of this project is development, investigation and testing of efficient thermal management solutions based on heat-storing layer systems through phase transition processes. The research project was focused on investigation of sugar alcohols as PCM because of its wide range of melting temperature, high enthalpy of fusion and low cost.

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