2017
DOI: 10.1149/2.0241701jss
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Thermal Performance Enhancement of Light Emitting Diode Device with Multilayer-Graphene Transferred to the Substrate Surface

Abstract: The heat centralization of high power light emitting diode becomes a challengeable issue by reason of the strong relationship between device reliability and operating temperature. The purpose of this work is to study the thermal behavior of light emitting diode device with graphene film transferred to the substrate surface. The experiment results show that junction temperature of the device with graphene film transferred to the alumina ceramic substrate surface is about 2.2°C lower. And the thermal resistance … Show more

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Cited by 3 publications
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