Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

Gabsi, Inès; Maalej, Samah; Zaghdoudi, Mohamed Chaker

doi:10.1016/j.microrel.2018.02.023

Cited by 19 publications

(12 citation statements)

References 17 publications

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“…In this section, to predict the LHP performance and optimize the geometrical parameters of the evaporator and the wick, a steady-state model will be briefly described. This analytical model is based on that developed by Gabsi et al, [52]. The LHP geometry used in the model is presented in Figure 1.…”

Section: Model Descriptionmentioning

confidence: 99%

“…The Poiseuille number, Po, is calculated according to Gabsi et al, [52] 0 = 24 (1 − 1.355 + 1.947 2 − 1.701 3 + 0.956 4 − 0.254 5 ) (…”

Section: Momentum Balance Equationsmentioning

confidence: 99%

“…Aw is the porous cross-section. Kw is the wick permeability which is calculated by a general correlation including the pore diameter, Dp, and the porosity of the porous medium, w [52]…”

Section: Momentum Balance Equationsmentioning

confidence: 99%

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Modeling of Loop Heat Pipe Thermal Performance

Gabsi

Maalej

Zaghdoudi

2021

ARFMTS

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The present work deals with the heat transfer performance of a copper-water loop heat pipe (LHP) with a flat oval evaporator in steady-state operation. Modeling the heat transfer in the evaporator was particularly studied, and the evaporation heat transfer coefficient was determined from a dimensionless correlation developed based on experimental data from the literature. The model was based on steady-state energy balance equations for each LHP component. The model results were compared to the experimental ones for various heat loads, cooling temperatures, and elevations, and a good agreement was obtained. Finally, a parametric study was conducted to show the effects of different key parameters, such as the axial conductive heat leaks between the evaporator and the compensation chamber cases, the capillary structure porosity and material, and the groove dimensions.

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Section: Model Descriptionmentioning

confidence: 99%

“…The Poiseuille number, Po, is calculated according to Gabsi et al, [52] 0 = 24 (1 − 1.355 + 1.947 2 − 1.701 3 + 0.956 4 − 0.254 5 ) (…”

Section: Momentum Balance Equationsmentioning

confidence: 99%

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Modeling of Loop Heat Pipe Thermal Performance

Gabsi

Maalej

Zaghdoudi

2021

ARFMTS

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“…A hybrid structure improves the heat pipe performance by the conciliation of two common capillary structures (Paiva & Mantelli, 2015). Some studies available in the literature about different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging are those by Obata, Fukushima, Alves, Bazani, and Paschoalini (2016), Gabsi, Maalej, and Zaghdoudi (2018), Grissa, Benselama, Lataoui, Bertin, and Jemni (2018), He et al (2018), Han, Wang, and Liang (2018), Santos, Alves, Oliveira, and Bazzo (2018), Liu, Li, and Fan (2019), Tian, He, Liu, and Liu (2019), Velardo et al (2019), He et al (2020), Xiau et al (2020), and Zhou, Li, Chen, Deng, and Gan (2020).…”

Section: Introductionmentioning

confidence: 99%

Experimental research of capillary structure technologies for heat pipes

et al. 2020

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This paper presents an experimental study on three different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging. The first capillary structure is that of axial grooves manufactured by wire electrical discharge machining (wire-EDM). The sintering process with copper powder produced the second heat pipe. Finally, a hybrid heat pipe was made by the combination of the two previous methods. The heat pipes were produced using copper tubes with an outer diameter of 9.45 mm and a length of 200 mm, and were tested horizontally at increasing heat loads varying from 5 to 35 W. The working fluid used was distilled water. The experimental results showed that all capillary structures for heat pipes worked successfully, so the studied manufacturing methods are suitable. Nonetheless, the hybrid heat pipe is the best, due to the lowest thermal resistance presented.

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“…To address the increasingly severe cooling issue, various heat pipe-integrated cooling systems have been developed and studied recently [6][7]. Xiao et al proposed a U-shaped heat pipe cooling system with a fan to solve the thermal management problem of high-power LEDs [8].…”

Section: Introductionmentioning

confidence: 99%

Quiet power-free cooling system enabled by loop heat pipe

Bai

Lin

et al. 2019

Applied Thermal Engineering

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Loop heat pipe (LHP) is a quite promising two-phase heat transfer device, holding significant application potential in the modern electronics cooling. In this work, a LHP-based cooling system has been developed, which features no power consumption and no noise, taking full advantage of LHP's efficient longdistance heat transport capability. The heat source was simulated by a film electric resistance heater, which was connected to the cylindrical evaporator of the LHP through an aluminum saddle. The condenser line was embedded into the bottom surface of a fin radiator with a relatively large volume, where heat dissipation to the ambient was completely in the form of air natural convection. Extensive experiments on this cooling system were conducted, mainly focusing on its startup and system thermal resistance. Experimental results show that this cooling system can successfully realize the startup with a very small heat load. With the film heater temperature not exceeding 80 , this cooling system can dissipate a heat load up to 150 W to the ambient at a temperature about 24 , corresponding to a system thermal resistance about 0.30 /W. In addition, this cooling system exhibited very strong anti-gravity capability. With an adverse elevation of 0.5 m, the cooling system can realize normal operation, and no obvious performance decay was observed except an increased operating temperature at small heat loads.

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Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling

Cited by 19 publications

References 17 publications

Modeling of Loop Heat Pipe Thermal Performance

Modeling of Loop Heat Pipe Thermal Performance

Experimental research of capillary structure technologies for heat pipes

Quiet power-free cooling system enabled by loop heat pipe

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