Thermal properties of diamond/Cu composites enhanced by TiC plating with molten salts containing fluoride and electroless-plated Cu on diamond particles

Li, Hongwei; Xie, Yueyang; Zhang, Liqi; Wang, Huina

doi:10.1016/j.diamond.2022.109337

Cited by 13 publications

(4 citation statements)

References 39 publications

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“…The diamond surface was first coated with tungsten, and then coated with copper. H. Li [48] used a molten salt containing NaCl, KCl, and NaF to form a thin TiC coating on diamond, followed by chemical copper plating. The double coating (TiC-Cu) improved the thermal performance of diamond/Cu composite materials.…”

Section: Diamond Surface Treatmentmentioning

confidence: 99%

“…SBC is a highly efficient, cost-effective, and s ple method, which has a wide range of applications. H. Li [48] used molten salt to form thin coating of TiC on diamond particles, followed by chemical plating of copper. As temperature increased, the thickness of the formed TiC coating increased, resulting Vacuum micro-evaporation plating (VMEP) is a process that activates the atoms on the surface of the metal under vacuum conditions.…”

Section: Diamond Surface Treatmentmentioning

confidence: 99%

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Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

et al. 2023

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Copper-based diamond composites have been the focus of many investigations for higher thermal conductivity applications. However, the natural non-wetting behavior between diamond particles and copper matrix makes it difficult to fabricate copper-based diamond composites with high thermal conductivity. Thus, to promote wettability between copper and diamond particles, the copper/diamond interface must be modified by coating alloying elements on the diamond surface or by adding active alloying elements with carbon in the copper matrix. In this paper, we review the research progress on copper-based diamond composites, including theoretical models for calculating the thermal conductivity and the effect of process parameters on the thermal conductivity of copper-based diamond composites. The factors that affect interfacial thermal conductivity are emphatically analyzed in this review. Finally, the current problems of copper-based diamond composites and future research trends are recommended.

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Section: Diamond Surface Treatmentmentioning

confidence: 99%

Section: Diamond Surface Treatmentmentioning

confidence: 99%

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

et al. 2023

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“…The selection of particle types in the metal matrix is crucial for functionalization and application possibilities. For instance, wear-resistant composite coatings with metallic Ni matrices containing SiC particles [7] or Cu/diamond composite coatings exhibit excellent thermal transport properties and wear/hardness resistance [8]. Moreover, ultra-thin copper matrix composites with MXene as a second phase have proven effective for electromagnetic interference shielding [9].…”

Section: Introductionmentioning

confidence: 99%

Hardness and Wettability Characteristics of Electrolytically Produced Copper Composite Coatings Reinforced with Layered Double Oxide (Fe/Al LDO) Nanoparticles

Sasi Maoloud Mohamed,

Nikolić,

Vuksanović

et al. 2024

Coatings

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The lab-made ferrite-aluminium layered double oxide (Fe/Al LDO) nanoparticles were used as reinforcement in the production of copper matrix composite coatings via the electrodeposition route in this study. The Cu coatings electrodeposited galvanostatically without and with low concentrations of Fe/Al LDO nanoparticles were characterized by SEM (morphology), AFM (topography and roughness), XRD (phase composition and texture), Vickers microindentation (hardness), and the static sessile drop method (wettability). All Cu coatings were fine-grained and microcrystalline with a (220) preferred orientation, with a tendency to increase the grain size, the roughness, and this degree of the preferred orientation with increasing the coating thickness. The cross-section analysis of coatings electrodeposited with Fe/Al LDO nanoparticles showed their uniform distribution throughout the coating. Hardness analysis of Cu coatings performed by application of the Chicot-Lesage (C-L) composite hardness model showed that Fe/Al LDO nanoparticles added to the electrolyte caused a change of the composite system from “soft film on hard cathode” into “hard film on soft cathode” type, confirming the successful incorporation of the nanoparticles in the coatings. The increase in roughness had a crucial effect on the wettability of the coatings, causing a change from hydrophilic reinforcement-free coatings to hydrophobic coatings obtained with incorporated Fe/Al LDO nanoparticles.

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“…These alloying elements can react with C element, and form a continuous carbide layer at the diamond/Cu interface, which can effectively improve the interfacial bonding strength and thermal conductivity of the Cu/diamond composites. [9][10][11] Studies have shown that a carbide layer (2-3 nm) can significantly enhance the adhesion strength of diamond films to copper substrates, and a thicker carbide layer (10-50 nm) can improve the thermal conductivity of diamond/Cu composites by promoting better bonding between diamond particles and copper substrate. [12,13] Ren [14] found that the optimum thickness of Cr 7 C 3 layer ranged from 0.4 to 0.6 μm for diamond/Cr 7 C 3 /Cu interface system.…”

Section: Introductionmentioning

confidence: 99%

The Effects of Alloying Elements on the Bonding Strength of Diamond/Carbide/Cu Interface Based on First‐Principles Calculations

Cao

Yuan

et al. 2023

Physica Status Solidi (b)

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The effects of different alloying elements (Ti, Zr) on the bonding strength of the diamond (111)/carbide (111)/Cu (111) interface system have been systematically investigated by means of first‐principles calculations based on density functional theory. It is found that the metal (Ti, Zr)‐terminated carbide is more likely to participate in the formation of the carbide (111)/Cu (111) and carbide (111)/diamond (111) interface. However, the C‐terminated carbide (111) interfaces have higher bonding strength compared with the metal (Ti, Zr)‐terminated carbide interfaces. In the Cu/carbide/diamond interface system, the bonding strength of carbide/Cu interface is lower than that of the carbide/diamond interface, which means the Cu/carbide/diamond interface failure first occurs in the carbide/Cu interface. According to the charge density, the stronger charge interaction between Zr and Cu causes higher bonding strength of ZrC/Cu interface compared with TiC/Cu interface. Therefore, the Cu/ZrC/diamond interface has higher bonding strength compared with the Cu/TiC/diamond interface. The Csp (carbide)–Csp (diamond) covalent bond and the metal (Ti3d, Zr4d)–Csp (diamond) covalent bond are formed at the diamond/carbide interface, while the Cu3d–Csp (carbide) covalent bond and the metal (Ti3d, Zr4d)–Cu3d metallic bond are formed at the Cu/carbide interface.

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Thermal properties of diamond/Cu composites enhanced by TiC plating with molten salts containing fluoride and electroless-plated Cu on diamond particles

Cited by 13 publications

References 39 publications

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

Hardness and Wettability Characteristics of Electrolytically Produced Copper Composite Coatings Reinforced with Layered Double Oxide (Fe/Al LDO) Nanoparticles

The Effects of Alloying Elements on the Bonding Strength of Diamond/Carbide/Cu Interface Based on First‐Principles Calculations

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