Thermal properties of Sn-based solder alloys

Morando, C.; Fornaro, Osvaldo; Garbellini, O.; Palacio, H.

doi:10.1007/s10854-014-2036-6

Cited by 49 publications

(23 citation statements)

References 21 publications

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“…DTA experiments were performed by heating the samples in a Pt crucible withAl2O3 as the reference material. Five different heating rates (10,15,20,25 and 30 C min -1 ) were examined during the measurements.…”

Section: Experimental Details:-materials Preparations:-mentioning

confidence: 99%

Effect of Heating Ratesand Zn-Addition on the Thermal Properties Ofpb–snalloy.

Alnakhlani¹,

Hassan²,

Abdulhafiz³

et al. 2017

IJAR

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Section: Experimental Details:-materials Preparations:-mentioning

confidence: 99%

Effect of Heating Ratesand Zn-Addition on the Thermal Properties Ofpb–snalloy.

Alnakhlani¹,

Hassan²,

Abdulhafiz³

et al. 2017

IJAR

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“…Solders produce paths for electrical and thermal flow to additionally create a functional system which also incorporate mechanical integrity in the assemblies (Morando, Fornaro, Garbellini & Palacio, 2014).…”

Section: Literature Reviewmentioning

confidence: 99%

“…Replacing the harmful solders with lead-free solders have been the main objectives since the past years. Typically, to find a suitable candidate solder alloy, the alloy needs to have a specific freezing range which is also suited to be used or processed with existing technologies and machineries (Morando, Fornaro, Garbellini & Palacio, 2014).…”

Section: Sn-pb Soldersmentioning

confidence: 99%

“…It is crucial for the liquidus temperature of leadfree alloys to be low enough to prevent any thermal damage to the electronic components when exposed to high temperatures in wave or reflow soldering. Despite that, the solidus temperature also has to be high enough to ensure that the joint reliability of the solder connection is maintained throughout the exposure to thermomechanical fatigue (Morando, Fornaro, Garbellini & Palacio, 2014).…”

Section: Sn-pb Soldersmentioning

confidence: 99%

“…The limitations of Sn-Cu system include poor wettability, weak resistance to thermal fatigue as well as high melting point (Mohd Salleh, Sandu, Abdullah, Sandu & Saleh, 2017). Therefore, an improvement of Sn-Cu system; Sn-CuNi alloy has been developed (Morando, Fornaro, Garbellini & Palacio, 2014). …”

Section: Sn-cu Soldersmentioning

confidence: 99%

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Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

Mazlan¹

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Use of leaded solder was an issue in human health a few years back, while lead-free solders developed recently possesses higher melting temperature than conventional leaded solders. Thus, further research to develop more Sn-based solders with low-eutectic temperatures as compared to existing alloys are required. In this study, the effects of Gallium addition to five Sn-based alloys (Sn, SAC, Sn100C, Sn100CV, Sn-0.7Cu) at three different concentrations (0wt%Ga, 0.1wt%Ga and 2.0wt%Ga) was investigated. The microstructures of these alloys and the nature of their interactions with substrates including Electroless Nickel Immersion Gold (ENIG) and Organic Solderability Preservative (OSP) finishes is discussed.Thermal Analysis was done to investigate the resulting nucleation temperature of each alloy. The Sn-based alloys with 2.0wt% Ga additions had a reduction of 2℃-7℃ in growth temperatures when compared to their solidus temperatures. This matches the prediction from Sn-Ga phase diagram from previous studies. The intermetallic layers that formed between the solder and substrate showed that 0.1wt% Gallium resulted in a reaction with both Copper OSP and Nickel ENIG substrates, but higher concentrations of Ga (2.0wt%) did not result in a reaction at the interface. The microstructure analysis also showed that cracks formed in the cast specimens containing Ga and the solder balls appeared to have poorer wettability with increased Ga content. Both results suggested that there is segregation of Ga due to its low melting point, inducing low melting phase during solidification.In conclusion, the results indicate there is a critical composition of Ga which produces a homogeneous reaction with the alloys to assist in the fabrication of solder balls. Further studies on the properties of Ga containing alloys are required to fully understand the commercial potential.

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Experimental study on the discharge characteristics of two eutectic solder packed bed latent heat storage systems

Mawire

Ekwomadu

Lefenya

et al. 2020

Intl J of Energy Research

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Metallic solder based PCMs possess higher thermal conductivities, larger storage masses and exhibit lower subcooling effects compared to their organic or inorganic counterparts. It is thus justified to investigate their potential usage for medium temperature applications. These solders are relatively expensive and can be combined with cheaper PCMs in cascaded storage systems which are more thermodynamically efficient compared to single PCM systems as reported recently. The aim of the research is thus to compare two packed bed storage systems during discharging cycles using eutectic solder (Sn63/Pb37), that is widely available worldwide. The single PCM system (40 capsules) consists of encapsulated spheres of eutectic solder, whereas the second cascaded system consists of encapsulated spheres of eutectic solder and erythritol in an equal storage ratio in the tank. For the cascaded system, the eutectic solder capsules are placed at the top and erythritol at the bottom of the storage tank (20 capsules at the top and 20 at the bottom). The effect of the discharging flow-rates of 4 mL/s, 6 mL/s and 8 mL/s is investigated in relation to the temperature profiles, energy rates and exergy rates. Increasing the flow-rate, increases heat transfer rate thus shortening the discharging time as well as increasing thermal profile reversals during discharging. The peak energy and exergy rates increase with the increase in the flow-rate for the two storage systems. The single PCM system shows slightly higher average energy and exergy rates compared to the cascaded system possibly due to its higher thermal conductivity. The cascaded PCM system shows higher average stratification numbers at all the flow rates considered. The non-cascaded system exhibited slightly higher exergy recovery efficiencies compared to the cascaded PCM system possibly due to its higher thermal conductivity at all flow-rates considered. The effect of the initial discharging temperature is also investigated with a discharging flow-rate of 6 mL/s after charging with set heater temperatures of 260 C, 280 C and 300 C, respectively. Comparable thermal profiles are seen for both systems for the three set temperatures; however, the single PCM system shows slightly higher storage temperatures. The single PCM shows slightly higher but comparable peak and average discharging energy rates compared to the cascaded system. The exergy rates for the two systems are also comparable.

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Thermal properties of Sn-based solder alloys

Cited by 49 publications

References 21 publications

Effect of Heating Ratesand Zn-Addition on the Thermal Properties Ofpb–snalloy.

Effect of Heating Ratesand Zn-Addition on the Thermal Properties Ofpb–snalloy.

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

Experimental study on the discharge characteristics of two eutectic solder packed bed latent heat storage systems

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