Graphene,
hexagonal boron nitride (h-BN), and their heterostructures
are promising thermal interface materials due to the outstanding thermal
properties of graphene and h-BN. For the heterostructures, extensive
work has mainly focused on the thermal transport of two-dimensional
(2D) graphene/h-BN (GBN) in-plane heterostructures in which graphene
and h-BN are bonded at the interface. In this study, we investigate
the thermal conductivity of three-dimensional (3D) GBN van der Waals
(vdW) heterostructures by means of nonequilibrium molecular dynamics
(NEMD) simulations. Unlike the 2D GBN in-plane heterostructure, the
3D GBN vdW heterostructure consists of three layers where graphene
is sandwiched by two h-BN sheets via vdW forces. Various techniques,
including hydrogen-functionalization, vacancy defects, tensile strain,
interlayer coupling strength, layer numbers of h-BN, size effect,
and temperature, are extensively explored to find an effective route
for the modulation of the thermal conductivity. It is found that the
thermal conductivity of the triple-layer GBN vdW heterostructure is
very sensitive to these extrinsic factors. Of these, hydrogen-functionalization
is the most effective method. A low hydrogen coverage of 1% in the
sandwiched graphene can lead to 55% reduction in the thermal conductivity
of the vdW heterostructure. Vacancy defects on graphene exert a more
significant effect on the thermal conductivity reduction for the vdW
heterostructure than B or N vacancies in the outer h-BN layers. This
work reveals the physical mechanism for manipulating the thermal transport
along the GBN vdW heterostructures via structural modification and
provides a useful guideline for designing novel thermal management
devices based on the GBN vdW heterostructures.