Thermal residual strains and stresses in Al2O3/Al composites with interpenetrating networks

The mechanical properties of co-continuous Si3N4/Al composites manufactured by squeeze casting

“…It should also have a higher thermal conductivity and higher fracture toughness than the ceramic matrix composite with the same volume fraction of ductile metal as the toughening phase distributed as discrete, isolated particles in the ceramic matrix [10,14]. Due to a unique combination of high stiffness of the ceramic and plastic deformation capability of the metal phase, or the presence of synergistic effects for some properties, this kind of composite is expected to acquire good properties from both the continuous ductile metal network and in the ceramic preform [13,15]. So, the co-continuous Si 3 N 4 /Al composites are emerging as materials with potential for structural applications where higher strength, specific modulus and superior wear characteristics are desirable.…”

Wetting and pressureless infiltration in the CuTi/Al2O3 system under poor vacuum

“…The fine and interpenetrating ceramic/ metal networks provide the composite with a high structural homogeneity and good ceramic to metal bonding. This type of composites offers a wild range of application and has been widely studied [4][5][6][7]. To obtain a composite with high strength, high electric conductivity, and high thermal conductivity and wear resistance, copper-alumina system is chosen.…”

Ceramic foam-reinforced Al-based micro-composites

“…These advantages include containing a higher volume fraction of a desired second phase, superior mechanical properties (especially toughness) due to a unique combination of high stiffness of the ceramic and plastic deformation capability of the metal phase, or the presence of synergistic effects for some properties [7]. Thus, papers have appeared in the scientific literature dealing with the infiltration of metal into sintered ceramic powder performs [8][9][10][11], interconnected ceramic fibers [12,13], or into ceramic foams [14][15][16][17][18].…”