2017
DOI: 10.3390/app7010108
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Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers

Abstract: A novel shape memory polymer composite was fabricated by introducing various amounts of silicon carbide whiskers (SiCws) into a shape memory epoxy. The relationship between the thermomechanical properties of the system and structural changes were investigated via dynamic mechanical analysis, scanning electron microscopy, and bending tests. The results show that the bend strength of composites can improve by 64.1% when SiCw content reaches 12 wt %. The shape transition temperatures of SiCw/epoxy composites decr… Show more

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Cited by 9 publications
(11 citation statements)
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References 33 publications
(32 reference statements)
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“…We have prepared epoxy-based SMPs filled with SiC w and reported a significant improve on bend strength for 64.1 per cent at 12 Wt.% of the SiC w . The shape fixity ratio increased as SiC w content increased (>99 per cent) and the shape recovery ratio slightly decreased as SiC w content increased (>95 per cent) (Wang et al, 2017).…”
Section: Introductionmentioning
confidence: 95%
“…We have prepared epoxy-based SMPs filled with SiC w and reported a significant improve on bend strength for 64.1 per cent at 12 Wt.% of the SiC w . The shape fixity ratio increased as SiC w content increased (>99 per cent) and the shape recovery ratio slightly decreased as SiC w content increased (>95 per cent) (Wang et al, 2017).…”
Section: Introductionmentioning
confidence: 95%
“…The storage modulus at T m increased with the increase of silicon carbide whiskers, from 5.1 GPa to 8.8 GPa, and the T g also increased by nearly 20°C. Wang et al [ 152 ] introduced different amounts of SiCws into the EP matrix to form SMEPC. When the content reached 12 wt%, the bending strength of the material increased by 64.1%, and the T g value decreased slightly with the increase of SiCw content.…”
Section: Smep Compositesmentioning
confidence: 99%
“…Schematic Illustration of the Shape-Morphing Process filler to the SMP, but the introduction of the filler deteriorates the performance of the shape-morphing process. 46,48,49 To overcome this drawback, we developed a novel polymer network in this research that shows excellent shape memory characteristics with high thermal conductivity.…”
Section: ■ Introductionmentioning
confidence: 99%