2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
DOI: 10.1109/eptc.2018.8654343
|View full text |Cite
|
Sign up to set email alerts
|

Thermal simulation and measurement of component in avionics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 7 publications
(3 citation statements)
references
References 3 publications
0
3
0
Order By: Relevance
“…This very wide range was useful for measuring the extension of the blind-zone. Thanks to the mixed-signal oscilloscope, the duty cycles of the outputs of the PFD (UP and DOWN) were measured; afterwards, from the measurement results, the PFD characteristic was derived as in (1), where D UP and D DOWN are the duty cycles of the two output signals. Furthermore, the propagation delay of the reset path was also derived from the measured duty cycles, thereby characterizing the reset time, which is related to the blind-zone.…”
Section: Pfd Char = D Up − D Downmentioning
confidence: 99%
See 2 more Smart Citations
“…This very wide range was useful for measuring the extension of the blind-zone. Thanks to the mixed-signal oscilloscope, the duty cycles of the outputs of the PFD (UP and DOWN) were measured; afterwards, from the measurement results, the PFD characteristic was derived as in (1), where D UP and D DOWN are the duty cycles of the two output signals. Furthermore, the propagation delay of the reset path was also derived from the measured duty cycles, thereby characterizing the reset time, which is related to the blind-zone.…”
Section: Pfd Char = D Up − D Downmentioning
confidence: 99%
“…PFD Char = D UP − D DOWN (1) All the measurements described so far were also performed at different temperatures to analyze the behavior of the CP when employed in applications characterized by harsh environments. In particular, the die was heated to reach temperatures up to 200 • C. Since the chip prototype was heated locally, the measured performance was not influenced by the instruments or other commercial components used for the test, which worked at room temperature for every measurement performed.…”
Section: Pfd Char = D Up − D Downmentioning
confidence: 99%
See 1 more Smart Citation