2018 19th International Conference on Electronic Packaging Technology (ICEPT) 2018
DOI: 10.1109/icept.2018.8480816
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Thermal Simulation into the Effect of Varying Encapsulant Media on Wire Bond Stress Under Temperature Cycling

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“…Previous publications that focus on the reliability or lifetime prediction of aluminum bonding wires mainly deal with wire bridges and not with the wire material itself. The influence of the organic or inorganic encapsulation on the reliability of the wire bridges, for example, is evaluated in [12,13], while [14][15][16] perform accelerated mechanical fatigue tests to investigate the influence of thermo-mechanical shear stress on wire lift-offs. The changes in the microstructure near the bonding interface and crack propagation due to power cycling are investigated by [17][18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…Previous publications that focus on the reliability or lifetime prediction of aluminum bonding wires mainly deal with wire bridges and not with the wire material itself. The influence of the organic or inorganic encapsulation on the reliability of the wire bridges, for example, is evaluated in [12,13], while [14][15][16] perform accelerated mechanical fatigue tests to investigate the influence of thermo-mechanical shear stress on wire lift-offs. The changes in the microstructure near the bonding interface and crack propagation due to power cycling are investigated by [17][18][19][20].…”
Section: Introductionmentioning
confidence: 99%