Thermal simulation of a high power loudspeaker

Abstract

Simulation of electromechanical systems is nowadays subject of very intensive investigation, mainly due to newly developed MEMS devices. There are numerous papers in relation to piezoelectric transformers and other piezoelectric transducers. Although not a MEMS, a loudspeaker is an electromechanical device, which study could offer interesting results and the approach can be transposed to other similar devices. For this paper which is a first approach on the subject, we have the intention to realize a thermal analysis, having as source the electrical power applied to the device. This analysis is done in order to establish a power level limit of a prototype loudspeaker. The finite element model will serve also as a basis for a further optimization and an acoustic analysis.

Numerical Investigation on the Temperature Characteristics of the Voice Coil for a Woofer Using Thermal Equivalent Heat Conduction Models

“…The voice coil temperature could be theoretically calculated using Equation (1). The temperature increase of the voice coil could be calculated by the resistance increase with the rising of the input power, as mentioned in Ciprian (2005) [18].…”