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Simulation of electromechanical systems is nowadays subject of very intensive investigation, mainly due to newly developed MEMS devices. There are numerous papers in relation to piezoelectric transformers and other piezoelectric transducers. Although not a MEMS, a loudspeaker is an electromechanical device, which study could offer interesting results and the approach can be transposed to other similar devices. For this paper which is a first approach on the subject, we have the intention to realize a thermal analysis, having as source the electrical power applied to the device. This analysis is done in order to establish a power level limit of a prototype loudspeaker. The finite element model will serve also as a basis for a further optimization and an acoustic analysis.

In the paper will be analyzed the reflections for different electronic modules, and for this will be computed, simulated and measured the voltage of reflection €or different situations. For a complex evaluation of reflection, different experimental electronic modules will be realized: double PCB realized in classically technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); the technological type of digital circuit. The measured results will be compared with computed and simulated results. An interesting comparison will be realized between the FR4 and mLA technology.