2020
DOI: 10.1007/s10909-020-02380-y
|View full text |Cite
|
Sign up to set email alerts
|

Thermal Simulations of Temperature Excursions on the Athena X-IFU Detector Wafer from Impacts by Cosmic Rays

Abstract: We present the design and implementation of a thermal model, developed in COMSOL, aiming to probe the wafer-scale thermal response arising from realistic rates and energies of cosmic rays at L2 impacting the detector wafer of Athena X-IFU. The wafer thermal model is a four-layer 2D model, where 2 layers represent the constituent materials (Si bulk and Si 3 N 4 membrane), and 2 layers represent the Au metallization layer's phonon and electron temperatures. We base the simulation geometry on the current specific… Show more

Help me understand this report
View preprint versions

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

1
12
0

Year Published

2020
2020
2022
2022

Publication Types

Select...
3
1

Relationship

2
2

Authors

Journals

citations
Cited by 4 publications
(13 citation statements)
references
References 7 publications
1
12
0
Order By: Relevance
“…The first and most important task we plan to carry out is to investigate the addition of wirebonds to increase the G of the detector wafer, and therefore the speed with which thermal fluctuations arising from the CR impacts in the wafer are evacuated to the thermal bath. This will have an overall effect on the level of the thermal noise from indirect CR impacts, as has been found in other studies [20]. Due to the large size of the LiteBIRD detector wafers, as well as their uncharacteristic thickness compared with other space missions, efficient thermal evacuation to the thermal bath is of crucial importance.…”
Section: Future Workmentioning
confidence: 67%
See 2 more Smart Citations
“…The first and most important task we plan to carry out is to investigate the addition of wirebonds to increase the G of the detector wafer, and therefore the speed with which thermal fluctuations arising from the CR impacts in the wafer are evacuated to the thermal bath. This will have an overall effect on the level of the thermal noise from indirect CR impacts, as has been found in other studies [20]. Due to the large size of the LiteBIRD detector wafers, as well as their uncharacteristic thickness compared with other space missions, efficient thermal evacuation to the thermal bath is of crucial importance.…”
Section: Future Workmentioning
confidence: 67%
“…The thermal model is a two-dimensional finite-element model with a virtual z-axis (using the same process as described in prior work [20]. However, unlike the X-IFU case, the LiteBIRD model consists only of one thermal layer due to the lack of a metallisation on the surface, i.e.…”
Section: Thermal Model Construction and Assumptionsmentioning
confidence: 99%
See 1 more Smart Citation
“…COMSOL uses finite-element modelling methods, and we use the Heat Transfer Module to assess the propagation of heat across the wafer at varying energies and energy deposition locations. Studies of this nature have been successfully performed for CR studies in other space instruments, notably Athena X-IFU, in which the impact of thermal fluctuations in the detector wafer on instrument energy resolution were assessed [19][20][21].…”
Section: Detector Wafer Thermal Modelmentioning
confidence: 99%
“…The thermal model is a two-dimensional finite-element model with a virtual z-axis (using the same process as described in prior work [20]). However, unlike the X-IFU case, the LiteBIRD JCAP09(2021)013 model consists only of one thermal layer due to the lack of a metallisation on the surface, i.e.…”
Section: Thermal Model Construction and Assumptionsmentioning
confidence: 99%