Thermal stability of microscale additively manufactured copper using pulsed electrodeposition

Daryadel, Soheil; Minary‐Jolandan, Majid

doi:10.1016/j.matlet.2020.128584

Cited by 17 publications

(10 citation statements)

References 17 publications

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“…Among these processes, CED has been shown to enable a great control over the microstructure of the printed metal from nanocrystalline to nanotwinned, direct printing of high electrical conductivity (close to the bulk values) metals (such as nickel and copper) on flexible substrates without a need to sintering, printing alloys with controlled composition, printing functional metals for various applications including magnetic applications, and for in situ electron microscope nanomechanical experiments. , However, the metal deposition rate (or the overall printing speed) of this process is reasonably slow because of the chemical nature of the process, in which pure metals or alloys are synthesized in situ by reduction from an electrolyte. There is a trade-off between the metal quality, purity, and properties on the one hand and the throughput on the other hand.…”

Section: Introductionmentioning

confidence: 99%

Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns

Bhuiyan

Moreno

Wang

et al. 2021

ACS Appl. Mater. Interfaces

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The metallic interconnects are essential components of energy devices such as fuel cells and electrolysis cells, batteries, as well as electronics and optoelectronic devices. In recent years, 3D printing processes have offered complementary routes to the conventional photolithography-and vacuum-based processes for interconnect fabrication. Among these methods, the confined electrodeposition (CED) process has enabled a great control over the microstructure of the printed metal, direct printing of high electrical conductivity (close to the bulk values) metals on flexible substrates without a need to sintering, printing alloys with controlled composition, printing functional metals for various applications including magnetic applications, and for in situ scanning electron microscope (SEM) nanomechanical experiments. However, the metal deposition rate (or the overall printing speed) of this process is reasonably slow because of the chemical nature of the process. Here, we propose using the CED process to print a single layer of a metallic trace as the seed layer for the subsequent selected-area electroless plating. By controlling the activation sites through printing by the CED process, we control, where the metal grows by electroless plating, and demonstrate the fabrication of complex thin-film patterns. Our results show that this combined process improves the processing time by more than 2 orders of magnitude compared to the layer-by-layer printing process by CED. Additionally, we obtained Cu and Ni films with an electrical resistivity as low as ∼1.3 and ∼2 times of the bulk Cu and Ni, respectively, without any thermal annealing. Furthermore, our quantitative experiments show that the obtained films exhibit mechanical properties close to the bulk metals with an excellent adhesion to the substrate. We demonstrate potential applications for radio frequency identification (RFID) tags, for complex printed circuit board patterns, and resistive sensors in a Petri dish for potential biological applications.

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Section: Introductionmentioning

confidence: 99%

Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns

Bhuiyan

Moreno

Wang

et al. 2021

ACS Appl. Mater. Interfaces

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“…Therefore, exploring the interaction between metallic chiral structures and photonic OAMs is of great significance for expanding the photonic dimensions of chiroptical phenomena. Furthermore, when the 3D metallic chiral microstructures are employed in the advanced chiroptical spectroscopy technique, it is highly possible that the chiroptical devices could experience elevated temperatures (i.e., up to 400 °C) . In virtue of this reason, the stability of 3D metallic microstructures in structures and chiroptical responses at higher temperatures is worthy of being further expounded.…”

Section: Introductionmentioning

confidence: 99%

Robust Helical Dichroism on Microadditively Manufactured Copper Helices via Photonic Orbital Angular Momentum

et al. 2023

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Three-dimensional chiral metallic metamaterials have already attracted extensive attention in the wide research fields of chiroptical responses. These artificial chiral micronanostructures, possessing strong chiroptical signals, show huge significance in next-generation photonic devices and chiroptical spectroscopy techniques. However, most of the existing chiral metallic metamaterials are designed for generating chiroptical signals dependent on photonic spin angular momentum (SAM). The chiral metallic metamaterials for generating strong chiroptical responses by photonic orbital angular momentum (OAM) remain unseen. In this work, we fabricate copper microhelices with opposite handedness by additively manufacturing and further examine their OAM-dominated chiroptical response: helical dichroism (HD). The chiral copper microhelices exhibit differential reflection to the opposite OAM states, resulting in a significant HD signal (∼50%). The origin of the HD can be theoretically explained by the difference in photocurrent distribution inside copper microhelices under opposite OAM states. Moreover, the additively manufactured copper microhelices possess an excellent microstructural stability under varying annealing temperatures for robust HD responses. Lower material cost and noble-metal-similar optical properties, accompanied with well thermal stability, render the copper microhelices promising metamaterials in advanced chiroptical spectroscopy and photonic OAM engineering.

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“…There are a few recent studies on using these technologies to create simple, metal microarchitectures such as micropillars with sample dimensions ranging from ∼1 µm to ∼10 µm [13,14]. Specifically, Daryadel et al have used a meniscus-confined pulsed electrodeposition method to create nanotwinned copper micropillars of ∼700 nm diameter [15,16]. Similarly, Raiser et al have reported the fabrication of sub-micron scale (∼400 nm diameter) multi-metal pillars using electrohydrodynamic redox printing [17].…”

Section: Introductionmentioning

confidence: 99%

Anomalous High Strain Rate Compressive Behavior of Additively Manufactured Copper Micropillars

Ramachandramoorthy¹,

Kalácska²,

Poras³

et al. 2022

Preprint

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Microscale dynamic testing is vital to the understanding of material behavior at application relevant strain rates. However, despite two decades of intense micromechanics research, the testing of microscale metals has been largely limited to quasi-static strain rates. Here we report the dynamic compression testing of pristine 3D printed copper micropillars at strain rates from ∼ 0.001 s −1 to ∼ 500 s −1 . It was identified that microcrystalline copper micropillars deform in a single-shear like manner exhibiting a weak strain rate dependence at all strain rates. Ultrafine grained (UFG) copper micropillars, however, deform homogenously via barreling and show strong rate-dependence and small activation volumes at strain rates up to ∼ 0.1 s −1 , suggesting dislocation nucleation as the deformation mechanism. At higher strain rates, yield stress saturates remarkably, resulting in a decrease of strain rate sensitivity by two orders of magnitude and a four-fold increase in activation volume, implying a transition in deformation mechanism to collective dislocation nucleation.

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Thermal stability of microscale additively manufactured copper using pulsed electrodeposition

Cited by 17 publications

References 17 publications

Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns

Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns

Robust Helical Dichroism on Microadditively Manufactured Copper Helices via Photonic Orbital Angular Momentum

Anomalous High Strain Rate Compressive Behavior of Additively Manufactured Copper Micropillars

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