Thermal stability of Ni(Pt) silicide films formed on poly-Si

Microstructure evolution with RTA temperature in nano-thick (Ru or Au)-inserted nickel silicides

“…It was reported that platinum-group elements can satisfy the aforementioned conditions [14,16]. Hence, it was expected that Ru and Au would satisfy these conditions.…”

Study of Nickel Silicide Thermal Stability Using Silicon-on-Insulator Substrate for Nanoscale Complementary Metal Oxide Semiconductor Field-Effect Transisor Device

“…The addition of near-noble elements such as palladium (Pd) or platinum (Pt) resulted in an improvement of thermal stability by delaying the phase transformation from lowresistivity nickel monosilicide to high-resistivity nickel disilicide. [8][9][10][11][12][13] In this study, Ni-Pd alloys with different Pd concentrations and various metal structures such as a Co/TiN doublecapping layer were used for investigating the thermal stability of nickel silicide. In this paper, we discuss the effects of Pd concentration and the metal structures on thermal stability using several analysis methods such as four-point probe measurement, field-emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), atomic force microscopy (AFM), and Auger electron spectroscopy (AES).…”

Improvement of Thermal Stability of Ni Silcide by Additive Metals with Specific Introduction Processes

“…For the purpose of improvement of the thermal stability, addition of other materials to the Ni-Si system has been investigated. Although successful results using various additive materials were reported [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16], the effects are often sensitive to the experimental conditions. The role of the additive materials has been discussed from various view points, however, comprehensive understanding of the mechanism has not been established for these techniques.…”