Thermal Stability of the High Strength High Conductivity Cu–Nb, Cu–V, and Cu–Fe Nanostructured Microcomposite Wires

Pantsyrny, V.; Khlebova, N. E.; Sudyev, S V; Kukina, O. V.; Beliakov, N.; Polikarpova, M.

doi:10.1109/tasc.2013.2293655

Cited by 11 publications

(15 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, V was chosen to enhance copper matrix in this study. Unfortunately, few studies on Cu–V alloy have been reported and most of these researches mainly focus on the Cu–V alloy wire by cold drawing and Cu–V multilayer films [16,17,18,19]. The vanadium fibre reinforced copper matrix wire presents very high strength, but like the Nb and Ag fibre, the V fibre would be divided and spheroidality, which could cause a sharply drop in strength.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Wang

Zou

et al. 2019

Materials

View full text Add to dashboard Cite

Cu-2.4 wt.%V nanocomposite has been prepared by mechanical alloy and vacuum hot-pressed sintering technology. The composites were sintered at 800 °C, 850 °C, 900 °C, and 950 °C respectively. The microstructure and properties of composites were investigated. The results show that the Cu-2.4 wt.%V composite presents high strength and high electrical conductivity. The composite sintered at 900 °C has a microhardness of 205 HV, a yield strength of 404.41 MPa, and an electrical conductivity of 79.5% International Annealed Copper Standard (IACS); the microhardness and yield strength reduce gradually with the increasing consolidation temperature, which is mainly due to the growth of copper grain size. After sintering, copper grain size and V nanoparticle both maintain in nanoscale; the strengthening mechanism is related to grain boundary strengthening and dispersion strengthening, while the grain boundary strengthening mechanism plays the most important role. This study indicates that the addition of small amounts of V element could enhance the copper matrix markedly with the little sacrifice of electrical conductivity.

show abstract

Section: Introductionmentioning

confidence: 99%

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Wang

Zou

et al. 2019

Materials

View full text Add to dashboard Cite

show abstract

“…A decrease in the tensile strength (49.3%) and increase in the electrical conductivity (13.3%) was reported by Pantsyrny et al 33 for Cu-Nb wires, which were heat-treated after the PD at 800 °C. This temperature was carefully selected and applied on a controlled filament size (Nb filament larger than 100 nm) during the PD.…”

Section: Processing Methodsmentioning

confidence: 54%

“…While majority of the studies about the DMMCw used inductive melting furnaces, 17,32 some authors also employed arc melting 6,18,34 and electron beam furnace. 33,36 Although high purity components are used during melting, the presence of impurities and reactions related to them are minimized by establishing an inert environment. 37 The melting of matrix and secondary phases may happen at different temperatures if they have different melting points (as in the case of Nb, Fe, and Cr reinforced Cu wires).…”

Section: Processing Methodsmentioning

confidence: 99%

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Zafar

Nair

2022

Proceedings of the Institution of Mechanical Engineers, Part L:

View full text Add to dashboard Cite

Deformation processed wires are used in the fields which demand the combination of contradictory properties such as mechanical strength and electrical conductivity. For the last 4–5 decades, scientists have focused on fabricating Cu and Al matrix wires using various plastic deformation techniques. While the high electrical conductivity is ensured through mentioned elements, the strength is achieved by orderly employment of plastic deformation and various heat treatments for basically achieving microscale filamentary structure of reinforcing elements. However, the strict selection criteria of starting materials and contradicting nature of processing regime and expected properties require proper knowledge of materials-microstructure and fabrication-property correlations. This paper summarizes the manufacturing methods, processing parameters-microstructure interactions, consequential mechanical and electrical properties and finally, current, and potential applications of deformation processed bi-metallic composite wires. It will help engineers, through provided comparative analysis, choose appropriate processing routes and starting materials for the realization of high strength/conductivity wires as well as guide what to expect in terms of targeted properties.

show abstract

“…Cu-based composites combine high strength with high conductivity, which makes them promising materials for electrical devices in which large electromagnetic and mechanical forces are exerted, particularly, for windings of high-field pulsed magnets [1,2]. In most cases, transition BCC metals with extremely low solubility in Cu (Nb, Fe, Cr, and V) or FCC Ag are used as additions to the copper matrix [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Microstructural Features in Multicore Cu–Nb Composites

et al. 2021

View full text Add to dashboard Cite

The study is devoted to heavily drawn multicore Cu–18Nb composites of cylindrical and rectangular shapes. The composites were fabricated by the melt-and-deform method, namely, 600 in situ rods of Cu–18%Nb alloy were assembled in a copper shell and cold-drawn to a diameter of 15.4 mm (e = 10.2) and then rolled into a rectangular shape the size of 3 × 5.8 mm (e = 12.5). The specimens were analyzed from the viewpoints of their microstructure, microhardness, and thermal stability. The methods of SEM, TEM, X-ray analysis, and microhardness measurements were applied. It is demonstrated that, at higher strain, the fiber texture 110Nb∥ 111Cu∥ DD (drawing direction), characteristic of this material, becomes sharper. The distortions of niobium lattice can be observed, namely, the 110 Nb interplanar distance is broadened in longitudinal direction of specimens and compacted in transverse sections. The copper matrix lattice is distorted as well, though its distortions are much less pronounced due to its recrystallization. Evolution of microstructure under annealing consists mainly in the coagulation of ribbon-like Nb filaments and in the vanishing of lattice distortions. The structural changes in Nb filaments start at 300–400 °C, then develop actively at 600 °C and cause considerable decrease of strength at 700–800 °C.

show abstract

Thermal Stability of the High Strength High Conductivity Cu–Nb, Cu–V, and Cu–Fe Nanostructured Microcomposite Wires

Cited by 11 publications

References 7 publications

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Microstructural Features in Multicore Cu–Nb Composites

Contact Info

Product

Resources

About