Thermal Stresses Due to a Plane Crack in General Anisotropic Material

Sturla, Francisco; Barber, J. R.

doi:10.1115/1.3173685

Cited by 45 publications

(17 citation statements)

References 7 publications

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“…For an in®nite domain subject to the thermal analog of a line dislocation with temperature discontinuity h 0 located at x 1 x 2 0, the solution of EqX1 4 is of the form [9] hz t h 0 2p Imln z t X 7…”

Section: Green's Function For Homogeneous Materialsmentioning

confidence: 99%

“…This enables us to easily represent a crack problem with the integral equations. Recently, the simplest solution of thermoelastic Green's functions has been obtained for a two-dimensional problem of an in®nite elastic plate subjected to a constant temperature discontinuity along the axis x 2 0 [9]. However, the formulation cannot be applied to the case of bimaterial problems.…”

Section: Introductionmentioning

confidence: 98%

“…It is well known that the Green's function method has some important advantages over the above-mentioned methods, such as transform methods. First, we note that the solution is expressed in terms of physical variables so that it is easier to determine at intermediate stages whether the solution is physically reasonable [9]. In particular, it is usually possible to express the solution in terms of distributions of Green's function over a ®nite range, with bounded or Archive of Applied Mechanics 68 (1998) 433±444 Ó Springer- Verlag 1998 integrable singular behaviour at the end points.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials

Qin

Mai

1998

Archive of Applied Mechanics (Ingenieur Archiv)

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For a two-dimensional piezoelectric plate, the thermoelectroelastic Green's functions for bimaterials subjected to a temperature discontinuity are presented by way of Stroh formalism. The study shows that the thermoelectroelastic Green's functions for bimaterials are composed of a particular solution and a corrective solution. All the solutions have their singularities, located at the point applied by the dislocation, as well as some image singularities, located at both the lower and the upper half-plane. Using the proposed thermoelectroelastic Green's functions, the problem of a crack of arbitrary orientation near a bimaterial interface between dissimilar thermopiezoelectric material is analysed, and a system of singular integral equations for the unknown temperature discontinuity, de®ned on the crack faces, is obtained. The stress and electric displacement (SED) intensity factors and strain energy density factor can be, then, evaluated by a numerical solution at the singular integral equations. As a consequence, the direction of crack growth can be estimated by way of strain energy density theory. Numerical results for the fracture angle are obtained to illustrate the application of the proposed formulation.

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Section: Green's Function For Homogeneous Materialsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials

Qin

Mai

1998

Archive of Applied Mechanics (Ingenieur Archiv)

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“…Examples of some articles in which the effect of heat flow in cracked materials is investigated are: [1][2][3][4][5][6][7][8][9][10][11] and the references cited therein, as well as Chapter 10 in the monograph [12]. The analysis of [13] of the singularities at the tip of interfacial cracks in anisotropic materials subjected to heat flow forms a generalization of the square root singularity that occurs in homogeneous materials.…”

Section: Introductionmentioning

confidence: 99%

The Induced Stress Field in Cracked Composites by Heat Flow

Aboudi

2017

J. Compos. Sci.

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Abstract:A multiscale (micro-macro) approach is proposed for the establishment of the full thermal and induced stress fields in cracked composites that are subjected to heat flow. Both the temperature and stresses' distributions are determined by the solution of a boundary value problem with one-way coupling. At the micro level and for combined thermomechanical loading, a micromechanical analysis is employed to determine the effective moduli, coefficients of thermal expansion and thermal conductivities of the undamaged composite. At the macro level, the representative cell method is employed according to which the periodic damaged composite region is reduced, in conjunction with the discrete Fourier transform, to a finite domain problem. As a result, a boundary value problem is obtained in the Fourier transform domain, which is appropriately discretized and solved. The inverse transform and an iterative procedure provide the full thermal and stress fields. The proposed method is verified by comparisons with exact solutions. Applications are given for the determination of the thermal and stress fields in cracked fiber-reinforced polymeric composite, cracked porous ceramic material and cracked periodically-layered ceramic composite caused by the application of heat flow. The presented formulation admits however the application of a combined mechanical and heat flux on cracked composites.

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“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15]), mainly due to the widespread use of such materials in high-temperature environments. The increasing development of high-strength composite materials has driven researchers to focus on the effects of anisotropy in the thermomechanical fields for fractured bodies.…”

Section: Introductionmentioning

confidence: 99%

Thermally conductive elliptic inhomogeneities in 2D anisotropic solids

Ursescu

Dascalu

2006

Arch Appl Mech

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The problem of a thermally conductive elliptic hole embedded in an anisotropic thermoelastic solid under a remote uniform heat flow is considered. For the plane problem, solutions are derived by the use of an extended thermoelastic version of the Stroh formalism. The hoop stress around the elliptic hole is obtained in an explicit real form. We analyze the influence of the interior thermal conductivity and the cavity thickness on the temperature and stress on the boundary points of the hole. By comparison with the thermally insulated cavity, we show that the consideration of the interior conductivity may lead to significantly different thermomechanical behaviors.

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Thermal Stresses Due to a Plane Crack in General Anisotropic Material

Cited by 45 publications

References 7 publications

Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials

Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials

The Induced Stress Field in Cracked Composites by Heat Flow

Thermally conductive elliptic inhomogeneities in 2D anisotropic solids

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