Thermal techniques as applied to functional electronic blocks

Matzen, W.T.; Meadows, R.A.; Merryman, J.D.; Emmons, S.P.

doi:10.1109/proc.1964.3438

Cited by 27 publications

(3 citation statements)

References 2 publications

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“…From an analogy between an RC transmission line and heat flow equations (where heat flow is compared with current and temperature with voltage), the thermal transfer function for the thermal bar can be defined as (Matzen and Meadows 1964) TS…”

Section: Transfer Function-of Thermal Delay Elementmentioning

confidence: 99%

Thermal diffusivity measurement of small silicon chips

Ebrahimi¹

1970

J. Phys. D: Appl. Phys.

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Section: Transfer Function-of Thermal Delay Elementmentioning

confidence: 99%

Thermal diffusivity measurement of small silicon chips

Ebrahimi¹

1970

J. Phys. D: Appl. Phys.

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“…The TSC was chosen as the basic circuit function, to be used in conjunction with an associated linear circuit whose thermal environment must be controlled [2], [3], [4].The circuit and the associated device are fabricated on a 63 nil X 63 nil square chip that is attached to a Manuscript received March 3, 1966. The supporting work for tkhtkifpaperwas done at Stewart-Warner Microcircuits, Sunnyvale,…”

Section: The Temperature Sensorcontrollermentioning

confidence: 99%

An Integrated Temperature Sensor-Controller

Prosser¹

1966

IEEE J. Solid-State Circuits

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Ab.sfracf-The temperature sensor-controller (TSC) and its associated circuit is a multifunctional or systems oriented linear monolithic integrated silicon device, It is designed for low cost (i.e., high yields) and high functional utility. The device has the capability of temperature stabilizing its own environment and that of an associated circuit over a wide temperature range. It can also measure and provide temperature control as well as function as a stable voltage reference. By utilizing several metallization masks the TSC is combined with an operational amplifier, a linear wide range voltage controlled oscillator, an active filter, and other linear circuit functions.

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“…However, these tools are very expensive and mostly used to simulate device-level behaviour, although some tools allow the capability of extracting the device model to a circuit-level model that can be used in SPICE-based simulation, but at an additional cost. As such, simpler SPICE models have been developed to couple the electrothermal parameters to electrical ones used in readout circuits for infrared microemitters and microbolometers (Kiran and Karunasiri, 1999;Nazdrowicz et al, 2015;Kim and Ko, 2015). However, we should highlight that the lack of an existing model hampers (i) the understanding and design of optimal thermal coupling devices and (ii) the design of effective readout circuits for ETC while accounting for thermal losses.…”

Section: Introductionmentioning

confidence: 99%

A two-port electrothermal model for suspended MEMS device structures with multiple inputs

Schoeman

Plessis

2019

J. Sens. Sens. Syst.

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Abstract. Advances in micromachining have led to the development of microelectromechanical systems (MEMS) devices with suspended structures used in a variety of sensors. Of note for this work are sensor types where two elements exist on the suspended membrane, including examples like air flow and differential pressure detectors, gas detection, and differential scanning calorimetry sensors. Intuitively one would argue that some thermal loss exists between the two elements. However, surprisingly little is documented about this electrothermal interaction. The work presented here addresses this shortcoming by defining a new parameter set, a matrix of thermal coupling coefficients. They are used within our novel two-port electrothermal model based on the heat flow equation adapted as a linear system of equations. However, the model is only effective with knowledge of these coefficients. We introduce an approach to extract the coefficients using finite-element method (FEM)-based multiphysics simulation tools and revisit and extend our previous method of non-ideal power coupling, this time to extract the coefficient matrix from measured data. Both specialist simulation tools and device manufacturing are very expensive. However, they are the only choices in the absence of an analytic model. A major contribution of this work is the derivation of a model to predict the coefficients by analytic means from the device dimensions and material properties. The research contribution and paper culminate in a comparison of analytic, simulated, and experimentally extracted values of two different devices to verify and demonstrate the effectiveness of the proposed models. The values compare well and show that the best results achieved are approximately 90 % and 70 % thermal linkage respectively for vacuum and atmospheric pressure conditions.

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Thermal techniques as applied to functional electronic blocks

Cited by 27 publications

References 2 publications

Thermal diffusivity measurement of small silicon chips

Thermal diffusivity measurement of small silicon chips

An Integrated Temperature Sensor-Controller

A two-port electrothermal model for suspended MEMS device structures with multiple inputs

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