2017
DOI: 10.1088/1361-648x/aa9043
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Thermal transport in topological-insulator-based superconducting hybrid structures with mixed singlet and triplet pairing states

Abstract: In the framework of the Bogoliubov-de Gennes equation, we investigate the thermal transport properties in topological-insulator-based superconducting hybrid structures with mixed spin-singlet and spin-triplet pairing states, and emphasize the different manifestations of the spin-singlet and spin-triplet pairing states in the thermal transport signatures. It is revealed that the temperature-dependent differential thermal conductance strongly depends on the components of the pairing state, and the negative diffe… Show more

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Cited by 12 publications
(20 citation statements)
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“…The role of an insulating interface is reported in Ref. [20] for a topological system. To further investigate on these results, in Fig.…”
Section: A Cooling Powermentioning
confidence: 89%
See 2 more Smart Citations
“…The role of an insulating interface is reported in Ref. [20] for a topological system. To further investigate on these results, in Fig.…”
Section: A Cooling Powermentioning
confidence: 89%
“…In Ref. [20] a finite BTK Z parameter induces a cooling power behaving very similarly to the standard BTK case (of Ref. [11]) with respect to Z.…”
Section: Introductionmentioning
confidence: 89%
See 1 more Smart Citation
“…This approach has used in Refs. [113,88,89], and the approach can be recast into a boundary problem for scattering matrices [114]. Following this approach, a periodic oscillation of differential conductance as a function of the injection energy was found.…”
Section: Interface Transparencymentioning
confidence: 99%
“…While the electrical properties of topological materials have been intensively studied [ 6 , 7 , 8 , 9 , 11 , 12 , 14 , 15 ], thermoelectric performance of these topological based devices has not yet received the same level of attention from the condensed matter community, besides some interesting examples [ 15 , 16 , 17 , 18 ]. The heat production due to Joule heating in nano and micro-devices is one of the biggest problems in current microelectronics, and there is a growing interest on new materials capable of mitigating energy dissipation.…”
Section: Introductionmentioning
confidence: 99%