2019
DOI: 10.1088/1361-6528/ab5042
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Thermally and electrically conductive multifunctional sensor based on epoxy/graphene composite

Abstract: This document is the author's post-print version, incorporating any revisions agreed during the peer-review process. Some differences between the published version and this version may remain and you are advised to consult the published version if you wish to cite from it.

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Cited by 73 publications
(62 citation statements)
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“…Graphene has attracted a great attention for fabrication of flexible electronics devices/sensors because of its outstanding properties such as ultra‐high toughness, high elasticity, high electron mobility, and transparency and high electrical conductivity . Compared with CNTs, graphene provide lower cost in fabrication in the epoxy composites .…”
Section: Introductionmentioning
confidence: 99%
“…Graphene has attracted a great attention for fabrication of flexible electronics devices/sensors because of its outstanding properties such as ultra‐high toughness, high elasticity, high electron mobility, and transparency and high electrical conductivity . Compared with CNTs, graphene provide lower cost in fabrication in the epoxy composites .…”
Section: Introductionmentioning
confidence: 99%
“…Preparation of GnPs is described elsewhere. 40 Briefly, 0.1 g GIC was heat-treated in a furnace at 700 C for 1 min to induce a thermal shock effect which assisted the subsequent exfoliation. The expanded product was cooled and then dispersed in acetone using ultrasonication for 2 h below 20 C (low temperature assisting the exfoliation process).…”
Section: Preparationmentioning
confidence: 99%
“…Preparation of GnPs is described elsewhere 40 . Briefly, 0.1 g GIC was heat‐treated in a furnace at 700°C for 1 min to induce a thermal shock effect which assisted the subsequent exfoliation.…”
Section: Experiments Detailsmentioning
confidence: 99%
“…For the purpose of dissipating thermal heat from these devices, materials with enhanced thermal conductivity are strongly recommended 28 . There are publications of nanocomposites based on electrical conductive materials/polymer for thermal conduction 29 32 , yet the exposure of electrical conductive materials of electronics and electrical devices may cause the contamination and corrosion, and even the risk of electric shock. Hence, encapsulation with electrical insulating materials is the necessary prerequisite.…”
Section: Introductionmentioning
confidence: 99%