Thermally Robust Multi-layer Non-Volatile Polymer Resistive Memory

Abstract

The feasibility of the charge-transfer based polymer resistive memory as a future data storage device was tested using a thermally robust polyimide and PCBM composite film, available by low-cost solution processing. The prototype device with a simple 4F 2 cross-point cell structure demonstrated basic non-volatile memory functions (> 1000 write/erase cycles and 1-week data retention in an ambient without encapsulation). Not only bi-polar but also uni-polar operation scheme with multi-level programming worked for the device. The cells on both the top and the bottom layers of a stacked device with additional heat budget of > 300 o C for 1 hour exhibited no degradation on the performance.

Silicon Oxide: A Non-innocent Surface for Molecular Electronics and Nanoelectronics Studies

“…This features the typical unipolar resistive switching that is only voltage-magnitude dependent but not polarity dependent. It should be noted that some resistive-switching systems 32,33 were presented similarly in both polarities, but these are essentially unipolar behaviors as described in Figure 4b.…”

One Transistor–One Resistor Devices for Polymer Non‐Volatile Memory Applications

“…[19] In addition, multilevel cells and multilayer stacking structures have been proposed to achieve high data-storage densities. [20][21][22][23] In spite of the extensive fundamental research on polymer memory devices, there have been little publications related to integrated polymer memory devices consisting of switch (transistor or diode) and memory (resistor) components. When polymer nonvolatile memory devices are scaled down and fabricated in a cross-point-type array structure, switch components, such as transistors or diodes, are indispensable to prevent unexpected crosstalk.…”

Multi-layer stackable polymer memory devices

“…Recently, Samsung (Cho et al 2006) demonstrated that by blending polyimide with [6, 6]-phenyl-C61 butyric acid methyl ester, a thermally robust polymer memory could be realized. A first demonstration of a two-layer stacked device was fabricated using the composite film.…”

“…So far, three different approaches Cho et al 2006;Kwan et al 2007) have been applied to polymer memory devices. In the next section, we will discuss the relative merits of these three methods.…”