2006
DOI: 10.1007/s11661-006-0072-4
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Thermally stable nanomultilayer films of Cu/Mo

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Cited by 18 publications
(8 citation statements)
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“…Figure 6 B uses the same colors of each data point to attribute the datum to a specific NMM structure (bcc/fcc, fcc/fcc, hcp/hcp, etc.) from the present study as well as the other previously identified studies from literature [ 17 , 18 , 19 , 20 , 52 , 63 , 65 , 66 , 67 , 68 , 69 ]. For a given subset of NMM structures (e.g., fcc/bcc), a more pronounced trend of decreasing normalized layer breakdown temperature with increasing surface energy mismatch is evident.…”
Section: Resultssupporting
confidence: 81%
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“…Figure 6 B uses the same colors of each data point to attribute the datum to a specific NMM structure (bcc/fcc, fcc/fcc, hcp/hcp, etc.) from the present study as well as the other previously identified studies from literature [ 17 , 18 , 19 , 20 , 52 , 63 , 65 , 66 , 67 , 68 , 69 ]. For a given subset of NMM structures (e.g., fcc/bcc), a more pronounced trend of decreasing normalized layer breakdown temperature with increasing surface energy mismatch is evident.…”
Section: Resultssupporting
confidence: 81%
“…Colors of the data points correspond to NMM alternating structure (e.g., bcc/fcc, fcc/bcc, etc.). from this study and other studies [ 17 , 18 , 19 , 20 , 52 , 63 , 65 , 66 , 67 , 68 , 69 ].…”
Section: Figuresupporting
confidence: 70%
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“…The hardness of the Cu layer near the interface increases because its tiny structure hinders dislocation movement, and the hardness of the Mo end reaches the highest value due to work hardening caused by high densification dislocation. [95,96]…”
Section: Dislocations Strengtheningmentioning
confidence: 99%