Thermo-mechanical analysis of advanced electronic packages in early system design

Sommer, J.-P.; Wittler, Olaf; Manessis, D.; Michel, B.

doi:10.1007/s00542-005-0024-8

Cited by 7 publications

(4 citation statements)

References 4 publications

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“…FE analysis has gained importance also in design support and failure evaluation for Flip Chip assemblies in automotive applications [19,20,21,22,23]. Based on a complete description of geometry, loading, and material parameters, the 378…”

Section: Simulationmentioning

confidence: 99%

High temperature potential of flip chip assemblies for automotive applications

Braun

Becker

Sommer

et al. 2005

Proceedings Electronic Components and Technology, 2005. ECTC '05.

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Flip Chip technology has been widely accepted within microelectronics as a technology for maximum miniaturization. Typical applications today are mobile products as cellular phones or GPS devices. The upper temperature limits for such applications range from 80 °C to a maximum of 125 °C. To widen the application range of Flip Chip technology and to address the volume market of automotive and industrial electronics the development of high temperature capable assemblies is crucial. Typical scenario for the integration of electronics into a car is a control unit in the engine compartment, where ambient temperatures are around 150 °C, package junction temperatures may range from 175 °C to 200 °C and peak temperature may exceed these values.When using Flip Chip technology under high temperature conditions major challenges are found in the application of interconnect media and supporting polymers. At elevated temperatures the intermetallic phase formation of lead-free solders might lead to a reliability decrease, where polymeric materials as substrate and encapsulant do potentially show mismatched thermo-mechanical properties or material degradation and thus reliability is reduced. Literature does typically describe Flip Chip technologies behavior on organic substrates for consumer applications, but almost no information is available on the performance at temperatures beyond 125 °C. Within the European project HOTCAR, dealing with high temperature electronics for automotive use in general, a German consortium consisting of an IC manufacturer (IFX), two technology users (Siemens VDO & Temic) and a research institute (Fraunhofer IZM) have cooperated to evaluate the high temperature potential of lead-free Flip Chip technology for automotive applications.According to automotive demands an experimental study on the suitability of advanced Underfill encapsulants for high temperature has been performed. With the outcome of this pre-study two promising underfill materials were selected and used in a test run with an automotive test vehicle. This comprises an automotive grade µController mounted on a substrate manufactured according to automotive standards, as the major system components. Solder material used was SnAg with a Ni UBM in combination with two different substrate finishes NiAu and immersion Sn. These test devices were submitted to temperature cycles according to automotive specifications with a maximum temperature of 150 °C. Intermetallic phase formation was studied after high temperature storage by cross sections and shear tests. Typical failure modes for Flip Chip failure have been identified and are described in detail.The experimental reliability investigations were backed by thermo-mechanical simulations. Taking advantage of the so-called submodelling technique, the solder joint behavior could be studied in detail for lead-free solders. Starting stress-free at 150 °C, the calculations followed the real thermal cycling regime. As primary results, the accumulated equivalent creep strain and creep strain energy di...

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Section: Simulationmentioning

confidence: 99%

High temperature potential of flip chip assemblies for automotive applications

Braun

Becker

Sommer

et al. 2005

Proceedings Electronic Components and Technology, 2005. ECTC '05.

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“…That leads to the development of PFEA. PFEA is rarely covered in articles and is not related to the parametric mesh system but only to material features, load boundary conditions and so on [1][2]. In this paper, a parametric mesh method of complicated special surfaces based on History is developed.…”

Section: Introductionmentioning

confidence: 99%

The Parametric Mesh Method Based on History and Process Parameters Optimization

Huang

Liu

Xie

et al. 2010

AMR

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In engineering technology, it is necessary to compare different designs in an optimization project. Therefore a big problem is how to obtain finite element analysis (FEA) data involving different parameters and how to acquire optimization parameters from the results of FEA to solve the optimization problem rapidly. The parametric mesh (Paramesh) method, automatically based on history of complicated special surfaces, is developed to obtain many results of FEA involving different parameters. This paper is presented to demonstrate the method of parametric finite element analysis (PFEA). The optimization method of process parameters optimization is based on combining PFEA/ ANN (artificial nerve net)/GA (genetic arithmetic) to find out optimization parameters. This allows one to rapidly obtain optimization parameters during a design by doing FEA only once. The research indicates that the parameters optimization method based on PFEA/ANN/GA in the product design can short the product development cycle, decrease material consumption and guarantee product quality, etc.

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“…This example points to the important packaging issue of connecting components consisting of different materials of construction so they can be safely operated at elevated process conditions over an extended period of time. In another recent report, the analysis of both the thermal and thermo-mechanical stresses that occur in a multilayer complex radio frequency (RF) device shows that detailed 3-D finite element simulation models can rigorously quantify these issues on a local level, thereby permitting application of a rational design approach . This type of in-depth engineering analysis generally allows optimization of subcomponents before prototypes are fabricated, which translates into obvious benefits from both timing and cost perspectives.…”

Section: Introductionmentioning

confidence: 99%

“…In another recent report, the analysis of both the thermal and thermo-mechanical stresses that occur in a multilayer complex radio frequency (RF) device shows that detailed 3-D finite element simulation models can rigorously quantify these issues on a local level, thereby permitting application of a rational design approach. 24 This type of indepth engineering analysis generally allows optimization of subcomponents before prototypes are fabricated, which translates into obvious benefits from both timing and cost perspectives.…”

Section: Introductionmentioning

confidence: 99%

Integrated Microreactor System for Gas-Phase Catalytic Reactions. 2. Microreactor Packaging and Testing

and¹,

Jensen²,

Schmidt

et al. 2007

Ind. Eng. Chem. Res.

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An integrated packaging system is developed for the multilayer laminate gas-phase microreactor die whose design and fabrication was described in Part 1 of this series. A commercial plastic socket used for integrated circuit testing was adapted so the reactor chip could be easily installed while maintaining consistent alignment with all electrical contacts. A heated fluidics interface was developed that connects the nonmetallic feed and product gas ports on the microreactor chip to metal tubing. Thermal experiments and 3-D finite-element heat transfer simulations of the combined socket-fluidics assembly showed that the plastic reactor socket could be safely operated up to 250°C. Other tests showed that the microreactor heaters were capable of achieving membrane temperatures in excess of 600°C.Step-response tests demonstrated that temperature changes of ca. 100°C could be achieved in less than 10 ms. Testing of the electrical leads on the reactor chip verified that the device resistance on a single reactor chip was uniform within a few percentage points. The packaged system developed here is used in Part 3 of this series to create a modular reactor board for incorporation into an integrated process system.

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Thermo-mechanical analysis of advanced electronic packages in early system design

Cited by 7 publications

References 4 publications

High temperature potential of flip chip assemblies for automotive applications

High temperature potential of flip chip assemblies for automotive applications

The Parametric Mesh Method Based on History and Process Parameters Optimization

Integrated Microreactor System for Gas-Phase Catalytic Reactions. 2. Microreactor Packaging and Testing

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