Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages

Prieto, R.; Colonna, Jean-Philippe; Coudrain, P.; Chevrier, N.; Assigbe, K. N.; Chéramy, S.; Farcy, A.

doi:10.1109/therminic.2016.7748641

Cited by 5 publications

(2 citation statements)

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“…Thermomechanical effects from sliding motion are generally investigated based on the tribology [22], [23]. So far, most of the contact resistance analyses are based on the Holm model [25]- [28]. Constriction resistance must be considered when the contact surface roughness is significant [25]- [27].…”

Section: Introductionmentioning

confidence: 99%

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Multiphysics Analysis of Hemispherical Bulk Conductor Hertzian Contact Under Uniaxial Mechanical Load

Ravelo¹,

Peyret

Penas

et al. 2019

IEEE J. Multiscale Multiphys. Comput. Tech.

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A multiphysics model of smoothed contact surface hemispherical contact under dynamic vibration stress is treated in this paper. The contact structure is applied to hemispherical conductor bulk materials. The structure electrothermomechanical (ETM) behavior is investigated based on the Hertz contact theory coupled with electrokinetic approach. An electrical circuit integrating the contact material properties is proposed. The contact surface deformation ETM expression is formulated. The transient variations of the contact conductor material temperatures in function of the mechanical vibrations are analytically described. The ETM parameters range versus the mechanical load stress is analyzed by considering aluminum alloy material hemispherical bulk with a radius varying from 10 µm to 1 mm. The contact radius can be totally deformed when the load is increased up to 20 kN. In addition, an innovative multiphysics computational method is validated numerically to determine the transient variation of the contact surface radius model from SPICE simulation by considering 0.5 kHz/1 kHz frequency presenting 0.5-kN amplitude sine wave, and arbitrary waveform dynamic vibrations. It was conjectured from numerical application, the hemispherical bulk contact temperature, and also the mechanism multiphysics phenomena governing the structure behavior. As ongoing research, the equivalent system tensorial statement illustrating the multiphysics interaction between the conductor contacts will be developed.

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Section: Introductionmentioning

confidence: 99%

“…So far, most of the contact resistance analyses are based on the Holm model [25]- [28]. Constriction resistance must be considered when the contact surface roughness is significant [25]- [27]. Numerical studies can also be performed in function of the contact geometry complexity [29].…”

Section: Introductionmentioning

confidence: 99%