Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate

Chen, Cheng; Hou, Fengze; Liu, Fengman; She, Qian; Cao, Liqiang; Wan, Lixi

doi:10.1016/j.microrel.2017.10.003

Cited by 19 publications

(6 citation statements)

References 19 publications

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“…9 and 10, respectively. CTE mismatch of epoxy molding compound type A is lower than that of epoxy molding type B, which reduces stress and warpage of the package leading to reduced delamination inside the package [27][28][29][30]. Fig.…”

Section: Fig5mentioning

confidence: 99%

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

2020

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This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside packages. The results showed that CTE of epoxy molding compound material type A is less CTE mismatch than that of epoxy molding compound material type B with both standard and roughness leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.

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Section: Fig5mentioning

confidence: 99%

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

2020

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“…Inadequate thermal management can cause deformation and failure in solder joints [ 94 ]; to increase reliability, filler adhesive materials can be used, such as epoxy resins with additional components such as boron nitride and aluminum trioxide, which have strong temperature resistance and thermal conductivity. According to the experimental findings, the inclusion of filler glue increased the fatigue life of solder junctions by a factor of three [ 95 ].…”

Section: Sip Reliability Optimization Solutionmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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“…Each cycle is 50 min, with 10 min during ramp up and down, and the dwell time of 15 min at -40°C and 125°C, respectively. Four temperature cycles were set because most of solder bumps can reach a steady state at the end of the fourth temperature cycle (Chen et al, 2017). The thermal-mechanical behavior of WLP with fine pitch copper post bumps was systematically studied by using ANSYS Mechanical software (v19.0, ANSYS Inc., Pittsburgh, PA., USA, 2018).…”

Section: Load and Boundary Conditionsmentioning

confidence: 99%

Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps

Sun

Gao

Zhao

2020

SSMT

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Purpose This study aims to investigate the several parameters in wafer-level packaging (WLP) to find the most critical factor impacting the thermal fatigue life, such as the height of copper post, the height of solder bump, the thickness of chip. The FEA results indicate the height of solder bumps is the most important factor in the whole structure. Design/methodology/approach The copper post bumps with 65 µm pitch are proposed to investigate the thermal-mechanical performance of WLP. The thermal cycle simulation is used to evaluate the reliability of WLP by using finite element analysis (FEA). Taguchi method is adopted to obtain the sensitivity of parameters of three-dimension finite element model, for an optimized configuration. Findings It can be found that the optimal design has increased thermal fatigue life by 147% compared with the original one. Originality/value It is concluded that the finite element simulation results show outstanding thermal-mechanical performances of the proposed 65 µm pitch copper post bumps of WLP, including low plastic strain, high thermal fatigue life, which are desired for mobile device.

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Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate

Cited by 19 publications

References 19 publications

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps

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