Nowadays with a rapid development of high temperature electrochemical devices, sealing technology is an issue of high practical relevance for the applicability of such equipment. Most commonly used joining technologies are glass joining, active metal brazing and reactive air brazing (RAB). [1] Glass joining is a relatively simple and cost-effective bonding method. However, for glass brazed joints, the maximum operation temperature is limited by the softening point of glass. [2,3] Active metal brazing requires a very stringent brazing atmosphere. Such joints have to be processed either under high vacuum or under very clean inert gasatmosphere, what causes comparatively higher processing costs than air-brazing processes. [1] Besides, recent studies also show that after long time operation in air, the active metal braze joints oxidize completely, maintaining little or no strength. [4,5] In an effort to find a cost-effective and stable brazing technique, RAB was developed. [2] Reactive air brazing uses reactive elements, which are at least partially dissolved in a noble metal solvent, to reactively modify the faying surface, such that the newly formed surface is readily wetted by the rest of the molten filler metal. [1] With the increased effort in the development of intermediate temperature SOFC systems, Ag and Ag-based materials for sealing and interconnection have gained increased interest. [6] As a precious metal, Ag possesses good chemical stability and lower costs than other precious metals like platinum and gold.