Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Zacková, Paulína; Kuruc, Marcel

doi:10.3390/met10020160

Cited by 19 publications

(3 citation statements)

References 20 publications

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“…To improve the wettability of ceramic material with Zn-Al-Mg solder, soldering with the assistance of active ultrasound was employed. The tensile strength of Zn-Al-Mg soldering alloys ranges from 82 to 169 MPa; the highest strength was observed in the solder with the lowest Mg content [10] .…”

Section: Figure 1 Ultrasound Effects In Liquid Media and Their Applicationmentioning

confidence: 99%

Innovation Ultrasonic Assistant Soldering in Electronics

Lanin

2021

JERA

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Innovative approaches in ultrasonic assistant soldering consist consists of increasing the activity of cavitation and accelerating diffusion processes at the interface between the solder and the soldering material. Besides that, it improves the effectiveness of cavitation processes in melts by saturating gas cavities with diamete rs that are smaller than the resonant sizes of cavitation germs. Gas saturation of liquids and melts raises level of cavitation pressure by 20 25%25%, that intensifies US processing of cleaning, soldering and metallization. Modelling diffusion process showed that the US activation increased the concentration of diffusing elements of Zn and Al in the interface depth by 15 20% on average, and the combined activation by the US and electric field increased it by 30 45%. Furthermore, as the energy quantity adsorbed by melt increases, increased amplitude and frequency of US vibrations induces concentration rise. The heat energy was also boosted by combining the activation of the melt–soldered material system with US vibrations energy and high current pulses. This allows for a faster increase in soldering temperature, as well as improved solder wettability.

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Section: Figure 1 Ultrasound Effects In Liquid Media and Their Applicationmentioning

confidence: 99%

Innovation Ultrasonic Assistant Soldering in Electronics

Lanin

2021

JERA

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“…It is also to be noted that in modern power module circuits and assemblies, various metallic conductors are also needed to be joined to the ceramic dies and circuits [12][13][14]. Various authors have suggested the use of active metal soldering and/or brazing or low-temperature Zn-based soldering [15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

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Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

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“…Wetting may be achieved by metallization of the substrate surfaces prior to the joining process [11], but an alternative, frequently used approach is adding chemically active elements, most commonly Ti, Zr and Hf to the solder alloy [12][13][14][15]. Furthermore, the use of Mg [16][17][18], V [19,20], Ta [21,22], Cr [23], Nb [24] and rare earth elements such as La [25,26] and Lu [27] is also reported in the literature. Wetting with the aid of active elements is associated with their enrichment at the substrate/solder interface, reaction with the substrate and consequently the formation of a reaction phase layer [28][29][30][31].…”

Section: Introductionmentioning

confidence: 99%

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

Weber

Rettenmayr

2020

J Mater Sci

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Active brazing is a commonly used method for joining dissimilar materials with at least one non-metallic component. In the present study, joining of SiO2 glass to 316L stainless steel was performed utilizing Bi–Ag-based solders. Ti up to a concentration of 4 and Mg up to 1 wt.% were added as active elements. Microstructures of the solder alloys in the as-cast state and of cross sections of the joined compounds were analysed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. In the as-cast state of the solder, Ti is found in Bi–Ti intermetallic phases; Mg is partially dissolved in the fcc-(Ag) phase and additionally contained in a ternary Ag-Bi-Mg phase. After soldering, a tight joint was generated using several alloy compositions. Ti leads to the formation of reaction products at the steel/solder and glass/solder interfaces, and Mg is exclusively accumulated at the glass/solder interface.

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Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder

Cited by 19 publications

References 20 publications

Innovation Ultrasonic Assistant Soldering in Electronics

Innovation Ultrasonic Assistant Soldering in Electronics

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

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