Thermodynamically stable states in eutectic systems

Kalashnikov, E. V.

doi:10.1134/1.1258703

Cited by 22 publications

(12 citation statements)

References 12 publications

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“…A number of studies dedicated to eutectic and neareutectic alloys revealed that the behavior and properties of these systems are ambiguous and contradictory [1,2]. Different models based on a statistical distribution of atoms in the melt or on a quasi-eutectical model, which was not identified with a crystalline eutectic but regarded in a dynamic sense, have been developed (see [1] and references therein).…”

Section: Introductionmentioning

confidence: 99%

“…Among different eutectics lead-tin alloys have considerable potential for advanced structural and electronic applications. The intensive interest in these solder alloys is attributed to their low cost and unique material properties including the high superplastic properties, low melting temperature, wettability, and good electrical conductivity [2]. However, different limitations to practical applications like the strain hardening or the excessive growth of intermetallic phases at the solder-substrate joint interfaces remain, and the understanding of the microstructure of these alloys is still the subject of recent works [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

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Electronic properties and viscosity of liquid Pb–Sn alloys

Plevachuk

Sklyarchuk

Yakymovych

et al. 2005

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electronic properties and viscosity of liquid Pb–Sn alloys

Plevachuk

Sklyarchuk

Yakymovych

et al. 2005

Journal of Alloys and Compounds

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“…The intensive interest in these solder alloys is attributed to their low cost and unique material properties including high superplastic properties, low melting temperature, wettability, and good electrical and thermal conductivities. [5][6][7][8][9][10] The electrical resistivity of Pb-Sn alloys at room temperature is well known, but few studies have been carried out on the dependence of electrical resistivity of Pb-Sn alloys on temperature and alloy composition. Thus, the aim of the present work is to investigate the dependence of electrical resistivity and thermal conductivity on temperature and Sn content in Pb-Sn solders.…”

Section: Introductionmentioning

confidence: 99%

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Çadırlı

Böyük

Kaya

et al. 2010

Journal of Elec Materi

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Pb (100Àx) -Sn x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 lm/s) in a temperature gradient (G = 4.8 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (q) with temperature in the range of 323 K to 423 K for the directionally solidified Pb-Sn solders were measured. The present measurements indicate that the electrical resistivity of the directionally solidified Pb-Sn solders increases with increasing temperature, whereas the resistivity of the Pb-Sn solders decreases with increasing Sn content. The dependency of the Lorenz number (L) on temperature and Sn content for the Pb-Sn solders was also investigated based on the Wiedemann-Franz law by using the measured values of the thermal (K) and electrical (r) conductivity for the same alloys.

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“…A number of studies dedicated to eutectic and near-eutectic alloys revealed that the behavior and properties of liquid metals or their alloys are ambiguous and contradictory [51,52]. Almost all the properties of liquid metals vary with the temperature.…”

Section: Thermal Properties Of Liquid Metalsmentioning

confidence: 98%

Liquid metal cooling in thermal management of computer chips

Jing

2007

Front. Energy Power Eng. China

148

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With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400-500 W/cm 2 , and are still steadily climbing. As a result, it is extremely hard to attain higher performance and reliability. Because the conventional conduction and forcedair convection techniques are becoming incapable in providing adequate cooling for sophisticated electronic systems, new solutions such as liquid cooling, thermoelectric cooling, heat pipes, vapor chambers, etc. are being studied. Recently, it was realized that using a liquid metal or its alloys with a low melting point as coolant could significantly lower the chip temperature. This new generation heat transfer enhancement method raised many important fundamentals and practical issues to be solved. To accommodate to the coming endeavor in this area, this paper is dedicated to presenting an overall review on chip cooling using liquid metals or their alloys as coolant. Much more attention will be paid to the thermal properties of liquid metals with low melting points or their alloys and their potential applications in the chip cooling. Meanwhile, principles of several typical pumping methods such as mechanical, electromagnetic or peristaltic pumps will be illustrated. Some new advancement in making a liquid metal cooling device will be discussed. The liquid metal cooling is expected to open a new world for computer chip cooling because of its evident merits over traditional coolant.

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Thermodynamically stable states in eutectic systems

Cited by 22 publications

References 12 publications

Electronic properties and viscosity of liquid Pb–Sn alloys

Electronic properties and viscosity of liquid Pb–Sn alloys

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Liquid metal cooling in thermal management of computer chips

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