Thermoelectric Conversion From Interface Thermophoresis and Piezoelectric Effects

Zeng, Yu‐Jia; Liu, Yueyang; Pan, Hui; Ding, Zhong-Ke; Zhou, Wu‐Xing; Tang, Li‐Ming; Li, Baowen; Chen, Ke‐Qiu

doi:10.3389/fphy.2022.823284

Cited by 5 publications

(2 citation statements)

References 64 publications

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“…This disturbance results in an unbalanced distribution of charge, contributing to a surface charge density that is able to be captured by the electrode [44]. In this process, mechanical energy is converted to electric energy [45]. Conversely, the conversion of electrical energy into mechanical energy is an inverse piezoelectric effect.…”

Section: Piezoelectric Effect and Polarization Mechanismsmentioning

confidence: 99%

A Review of Ultrathin Piezoelectric Films

Xie

Liu

et al. 2023

Materials

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Due to their high electromechanical coupling and energy density properties, ultrathin piezoelectric films have recently been intensively studied as key materials for the construction of miniaturized energy transducers, and in this paper we summarize the research progress. At the nanoscale, even a few atomic layers, ultrathin piezoelectric films have prominent shape anisotropic polarization, that is, in-plane polarization and out-of-plane polarization. In this review, we first introduce the in-plane and out-of-plane polarization mechanism, and then summarize the main ultrathin piezoelectric films studied at present. Secondly, we take perovskite, transition metal dichalcogenides, and Janus layers as examples to elaborate the existing scientific and engineering problems in the research of polarization, and their possible solutions. Finally, the application prospect of ultrathin piezoelectric films in miniaturized energy converters is summarized.

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Section: Piezoelectric Effect and Polarization Mechanismsmentioning

confidence: 99%

A Review of Ultrathin Piezoelectric Films

Xie

Liu

et al. 2023

Materials

View full text Add to dashboard Cite

show abstract

“…The vibration's amplitude is reduced by the heat generated, which also changes the system's resonance frequency. [3,4] Therefore, a coolant, such as air or oil, must be used during the ultrasonic-assisted machining process. Furthermore, in order to optimize the amplitude of the ultrasonic vibration, the resonance frequency change must be tracked.…”

Section: Introductionmentioning

confidence: 99%

Extended Abstract for ASPEN2022(2~4pages) The effects of the temperature on the Ultrasonic transducers

Choo¹,

Kurniawan²,

Xu³

et al. 2022

Asian Society for Precision Engineering and Nanotechnology (ASPEN 2022)

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Nowadays difficult-to-cut materials are widely used in industrial products such as automobile parts or aerospace parts. Thus, ultrasonic-assisted machining comes into the limelight for machining difficult-to-cut materials. Ultrasonic-assisted machining is a process that uses high-frequency vibration to the cutting tool to enhance the cutting force and surface integrity. The most important part of an ultrasonic machine device is the transducer, which generates ultrasonic vibrations. A high-frequency electrical signal is transformed into vibration motion in the ultrasonic transducer. However, during this process, heat is generated from the piezoelectric. The vibration amplitude of the ultrasonic transducers is reduced by this heat generation, which also changes the resonance frequency. Therefore, it needs a coolant when operating the ultrasonic transducer. The heat transfer in the operational condition of the ultrasonic transducer is examined in this paper with an infrared camera. Compare the conditions with and without coolant as well. Additionally, when the piezoelectric is in a high-temperature state, use an impedance analyzer to find the change in resonance frequency. The resonance frequency decrease by 0.91 % and the amplitude decreases by 32.9 % as the temperature reaches 70°C.

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Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation

Zeng,

Cheng

et al. 2024

Adv Funct Materials

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Interfaces play an important role in the heat and stress transfer within applications such as electronic cooling. The coexistence of apparently contradictory properties between heat dissipation and adhesion at interfaces poses a constant challenge for existing interface materials. Herein, a thermal interface material is reported, consisting of epoxy‐functionalized polydimethylsiloxane and aluminum fillers with excellent interfacial heat/force transfer ability. This material optimizes the combination of thermal conductivity of 3.46 W m−1 K−1 and adhesion energy of 1.17 kJ m−2. Using two viscoelastic models, the excellent interfacial force transfer ability is attributed to a hierarchical energy dissipation via the introduction of borate ester bonds and the aluminum filler networks. A simple kinetic bond model demonstrates that the borate ester bonds increase molecular chain segment mobility, allowing full extension at debonding interface for stress dispersion and efficient energy dissipation. The aluminum filler networks not only facilitate thermal transfer, but also dissipate the mechanical energy during filler network destruction due to the bond breakage between fillers. The excellent heat dispassion and mechanical stability are further demonstrated when this thermal interface material is used in flexible light emitting diodes and high‐power chips. This work provides a new strategy for balancing interfacial heat and force transfer.

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Thermoelectric Conversion From Interface Thermophoresis and Piezoelectric Effects

Cited by 5 publications

References 64 publications

A Review of Ultrathin Piezoelectric Films

A Review of Ultrathin Piezoelectric Films

Extended Abstract for ASPEN2022(2~4pages) The effects of the temperature on the Ultrasonic transducers

Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation

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