A Si-based
superlattice is one of the promising thermoelectric films for realizing
a stand-alone single-chip power supply. Unlike a p-type superlattice
(SL) achieving a higher power factor due to strain-induced high hole
mobility, in the n-type SL, the strain can degrade the power factor
due to lifting conduction band degeneracy. Here, we propose epitaxial
Si-rich SiGe/Si SLs with ultrathin Ge segregation interface layers.
The ultrathin interface layers are designed to be sufficiently strained,
not to give strain to the above Si layers. Therein, a drastic
thermal conductivity reduction occurs by larger phonon scattering
at the interfaces with the large atomic size difference between Si
layers and Ge segregation layers, while unstrained Si layers preserve
a high conduction band degeneracy leading to a high Seebeck coefficient.
As a result, the n-type Si0.7Ge0.3/Si SL with
controlled interfaces achieves a higher power factor of ∼25
μW cm–1 K–2 in the in-plane
direction at room temperature, which is superior to ever reported
SiGe-based films: SiGe-based SLs and SiGe films. The Si0.7Ge0.3/Si SL with controlled interfaces also exhibits a
low thermal conductivity of ∼2.5 W m–1 K–1 in the cross-plane direction, which is ∼5
times lower than the reported value in a conventional Si0.7Ge0.3/Si SL. These results demonstrate that strain and
atomic differences controlled by ultrathin layers can bring a breakthrough
for realizing high-performance light-element-based thermoelectric
films.