Harvesting biobased epoxy resins
with improved thermomechanical
properties (e.g., glass transition temperature T
g and storage modulus), mechanical and dielectric similar and
even superior to that of bisphenol A epoxy resin (DGEBA) is vital
to many applications, yet remains a substantial challenge. Here we
develop a novel eugenol-based epoxy monomer (TEU-EP) with a branched
topology and a very rich biobased retention (80 wt %). TEU-EP can
be well cured by 3,3′-diaminodiphenyl sulfone (33DDS) and the
resultant TEU-EP/33DDS system can be considered as a “single”
epoxy component, exhibiting adequate reactivity at high processing
temperatures. Importantly, compared with DGEBA/33DDS, TEU-EP/33DDS
achieves a 33 °C, 39% and 55% increment in the glass transition
temperature, Young’s modulus, and hardness, respectively, and
shows the improved creep resistance and dimensional stability. TEU-EP/33DDS
is also characterized by the considerably reduced permittivity, dielectric
loss factor, and flammability with high yield of pyrolytic residual.
Overall, TEU-EP endows the cured epoxy with a number of the distinguished
properties outperforming its DGEBA counterpart, and therefore may
find practical applications in demanding and even cutting-edge areas.