Thermosonic ball bonding behavior of Ag-Au-Pd alloy wire

Kumar, Sanjeev; Kwon, Hoontae; Heo, Young Il; Kim, Seung Hyun; Hwang, June Sub; Moon, Jeong Tak

doi:10.1109/eptc.2013.6745675

Cited by 5 publications

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“…The value for the Ag reference is below 2 μΩ·cm, shown as a yellow star in Figure . This value is in line with reference data in literature (1.8 μΩ·cm) . However, the Ag–Al films exhibit much higher electrical resistivity than that of pure hexagonal Ag 2 Al phase, which has approximately 6 μΩ·cm as reported by Santosh Kumar et.al .…”

Section: Resultsmentioning

confidence: 99%

“…This value is in line with reference data in literature (1.8 μΩ·cm) . However, the Ag–Al films exhibit much higher electrical resistivity than that of pure hexagonal Ag 2 Al phase, which has approximately 6 μΩ·cm as reported by Santosh Kumar et.al . High electrical resistivity of the Ag–Al films can be due to a larger amount of defects, leading to more electron scattering than in bulk materials, which are usually prepared with processes closer to equilibrium.…”

Section: Resultsmentioning

confidence: 99%

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Combinatorial Study of Gradient Ag–Al Thin Films: Microstructure, Phase Formation, Mechanical and Electrical Properties

Mao

Taher

Kryshtal

et al. 2016

ACS Appl. Mater. Interfaces

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A combinatorial approach is applied to rapidly deposit and screen Ag-Al thin films to evaluate the mechanical, tribological, and electrical properties as a function of chemical composition. Ag-Al thin films with large continuous composition gradients (6-60 atom % Al) were deposited by a custom-designed combinatorial magnetron sputtering system. X-ray diffraction (XRD), energy dispersive X-ray spectroscopy (EDX), scanning and transmission electron microscopy (SEM and TEM), X-ray photoelectron spectroscopy (XPS), nanoindentation, and four-point electrical resistance screening were employed to characterize the chemical composition, structure, and physical properties of the films in a time-efficient way. For low Al contents (<13 atom %), a highly (111)-textured fcc phase was formed. At higher Al contents, a (002)-textured hcp solid solution phase was formed followed by a fcc phase in the most Al-rich regions. No indication of a μ phase was observed. The Ag-Al films with fcc-Ag matrix is prone to adhesive material transfer leading to a high friction coefficient (>1) and adhesive wear, similar to the behavior of pure Ag. In contrast, the hexagonal solid solution phase (from ca. 15 atom %Al) exhibited dramatically reduced friction coefficients (about 15% of that of the fcc phase) and dramatically reduced adhesive wear when tested against the pure Ag counter surface. The increase in contact resistance of the Ag-Al films is limited to only 50% higher than a pure Ag reference sample at the low friction and low wear region (19-27 atom %). This suggests that a hcp Ag-Al alloy can have a potential use in sliding electrical contact applications and in the future will replace pure Ag in specific electromechanical applications.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%