Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array

McLaren, T.; Kang, Sayoon; Zhang, Wenge; Ju, Teh-Hua; Lee, Yung-Cheng

doi:10.1109/96.575567

Cited by 48 publications

(19 citation statements)

References 10 publications

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“…It is not only used for electrical connections, but also for sub-micron accuracy alignment in many packaging applications [22]- [24]. In addition, a series of work has been done on flip chip bump height control [25], [26]. Here, flip chip bonding with solder spheres and gold bumps were performed to examine corresponding reliability and repeatability.…”

Section: A Flip Chip Packagingmentioning

confidence: 99%

The design and assembly of surface-micromachined optical switch for optical add/drop multiplexer application

Lin

Chiou

Lin

et al. 2003

IEEE Trans. Adv. Packag.

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An assembly process including: flip-chip bonding, microelectromechanical (MEMS) structure release, and atomic layer deposition (ALD) is proposed to integrate a surface micromachined optical switch for optical add/drop multiplexer (OADM) applications. In the current optical switch designs, pre-stressed beams were used to pop up the micromirror and an electrode (substrate) under the beams was designed to perform ON/OFF function of the optical switch. In order to achieve desired popped-up angle for precise optical switching, a flip-chip bonding technique is applied to a mechanical stopper with an accurate joint height that can be used to constrain the movement of the micromirror. A conformal thin layer of dielectric material (Al 2 O 3 ) coated on the surfaces of device through an ALD coating process is used to improve vertical actuation force, as well as electrical isolation. Experiments indicate that the micromirrors fabricated by the present assembly process can achieve desired angle that meet the requirements of the proposed OADM configuration.

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Section: A Flip Chip Packagingmentioning

confidence: 99%

The design and assembly of surface-micromachined optical switch for optical add/drop multiplexer application

Lin

Chiou

Lin

et al. 2003

IEEE Trans. Adv. Packag.

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show abstract

“…The quartz window allows a CCD camera, mounted underneath the platform, to view the bump array and the chip simultaneously for alignment purposes. The platform, and hence the carrier, can be translated in the horizontal plane, and rotated about the vertical axis; it can also be tilted to achieve good parallelism between chip and carrier, an essential requirement for array bonding [9]- [11].…”

Section: Bump-to-chip Bondingmentioning

confidence: 99%

“…9 appears to contain both systematic and random components. The systematic component-an increase in bond strength from left to right-is believed to be associated with the presence of slight nonparallelism between the chip and the carrier during the bonding process [11], [12]. Unfortunately, at the time of measurement there was no diagnostic tool for monitoring the parallelism between chip and carrier prior to bonding.…”

Section: Shear Testsmentioning

confidence: 99%

Laser-assisted bumping for flip chip assembly

Wang

Holmes

2001

IEEE Trans. Electron. Packag. Manufact.

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“…Timothy developed a transverse TSFC bonder and assembled a 64 I/O chip to a glass substrate with gold pads. It was found that the bonding process is affected by process parameters such as bonding force, time, temperature, ultrasonic power, and coplanarity [3,4]. The bonding process has been experimentally optimized to increase the shear strength of the assembled flip chip die [5].…”

Section: Introductionmentioning

confidence: 99%