Modeling study of thermosonic flip chip bonding process

Wang, Fuliang; Chen, Yun

doi:10.1016/j.microrel.2012.03.029

Cited by 12 publications

(5 citation statements)

References 16 publications

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“…The weldability of various combined metals, the microstructural evolution of weld interfaces, and the optimized welding process parameters of interfacial metallurgical behaviors have so far been investigated. In addition, tremendous efforts have been made in thermo-mechanical analysis of the UW process through developed finite element models [15,16]. However, these experimental procedures are still limited by the spatial and temporal scales.…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulations of Atomic Diffusion during the Al–Cu Ultrasonic Welding Process

2019

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Ultrasonic welding (UW) is an important joining technique in the electrical industry. Molecular dynamic simulation has been shown to possess several advantages for revealing the evolution of the atomic-scale structure and the interpretation of diffusion mechanisms at the microscopic level. However, voids associated with the understanding of microstructure evolution in the weld zone and dynamic processes that occur during ultrasonically welded materials still exist, and no UW studies at the atomic scale have so far been reported. In this study, molecular dynamic simulations of UW between Al and Cu were performed to investigate the diffusion behaviors of Al and Cu atoms. The results confirmed the occurrence of asymmetrical diffusion at the Al/Cu interface during UW. Meanwhile, recovery was noticed in the disordered Al blocks at low temperature. The thickness of the diffusion layer increased with the welding time. For relatively long welding times (1 ns), the concentrations of Al and Cu revealed the appearance of phase transitions. In addition, the diffusion during UW was identified as a dynamic and unsteady process. The diffusion coefficient was much larger than that underwent during the steady diffusion process despite the low interfacial temperature (below 375 K), which was mainly attributed to shear plastic deformation at the interface.

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Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulations of Atomic Diffusion during the Al–Cu Ultrasonic Welding Process

2019

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“…Firstly, the design phase is the starting point of chip manufacturing, requiring precise drawing of circuit diagrams and determination of chip functionality and performance requirements. Subsequently, it enters the manufacturing phase, which includes multiple steps such as wafer preparation, photolithography, etching, deposition, etc [3]. These steps require high precision and strict environmental control.…”

Section: The Basic Process Of Chip Production and The Key Links Of Qu...mentioning

confidence: 99%

The Application of Quality Management in Chip Production

2024

JID

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This article explores the importance and specific applications of quality management in the chip production process. As a core link in high-tech manufacturing, chip production has extremely strict requirements for product quality. Quality management ensures the stability of the chip production process and the reliability of product quality through a series of methods and means. This article first introduces the basic process of chip production and the key links of quality control, and then analyzes in detail the core elements of quality management, including quality control, quality assurance, and quality improvement. In addition, the article also analyzes the main problems faced in chip production quality management through practical cases. Finally, the specific application of quality management in chip production was elaborated, including process control, design and process defects, supply chain management, process technology innovation, and prevention and resolution of personnel management issues. And the future development trend of chip production quality management was discussed. Through this study, the aim is to provide effective quality management strategies and practical methods for chip production enterprises, and promote the sustainable and healthy development of the chip industry.

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“…Firstly, subsections and dynamic meshing are used. This practise involves concentrating the element densities around the area of interests so save cost as shown in [15][16][17]. Details are presented in Section 2.1.…”

Section: Introductionmentioning

confidence: 99%

Finite element modelling for the investigation of edge effect in acoustic micro imaging of microelectronic packages

Lee¹,

Zhang²,

Harvey³

et al. 2016

Meas. Sci. Technol.

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In acoustic micro imaging of microelectronic packages, edge effect is often presented as artifacts of C-scan images, which may potentially obscure the detection of defects such as cracks and voids in the solder joints. The cause of edge effect is debatable. In this paper, a two-dimensional finite element model is developed on the basis of acoustic micro imaging of a flip-chip package using a 230 MHz focused transducer to investigate acoustic propagation inside the package in attempt to elucidate the fundamental mechanism that causes the edge effect. A virtual transducer is designed in the finite element model to reduce the coupling fluid domain, and its performance is characterised against the physical transducer specification. The numerical results showed that the Under Bump Metallization (UBM) structure inside the package has a significant impact on the edge effect. Simulated wavefields also showed that the edge effect is mainly attributed to the horizontal scatter, which is observed in the interface of silicon die-to-the outer radius of solder bump. The horizontal scatter occurs even for a flip-chip package without the UBM structure.

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Modeling study of thermosonic flip chip bonding process

Cited by 12 publications

References 16 publications

Molecular Dynamics Simulations of Atomic Diffusion during the Al–Cu Ultrasonic Welding Process

Molecular Dynamics Simulations of Atomic Diffusion during the Al–Cu Ultrasonic Welding Process

The Application of Quality Management in Chip Production

Finite element modelling for the investigation of edge effect in acoustic micro imaging of microelectronic packages

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