Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates

Roshanghias, Ali; Rodrigues, Augusto; Holzmann, Dominik

doi:10.1016/j.mee.2020.111330

Cited by 14 publications

(5 citation statements)

References 11 publications

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“…For the sake of comparison, a printed NFC antenna was also fabricated using a screen-printing method. Uncoated paper sheets (Mondi AG) with a grammage of 120 g/m2, a porosity of 50 mL/ min, a thickness of 100 µm and surface roughness of 1.2 µm (Ra) were screen printed with Ag paste (Dupont 5029) and dried at 90 • C in an oven [11]. Moreover, as a benchmark, a similar antenna design was also realized by using the printed circuit board (PCB) technology.…”

Section: Methodsmentioning

confidence: 99%

Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips

Kordzadeh

Holzmann

Binder

et al. 2020

IoT

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With the ongoing trend toward miniaturization via system-on-chip (SoC), both radio-frequency (RF) SoCs and on-chip multi-sensory systems are gaining significance. This paper compares the inductance of a miniaturized on-chip near field communication (NFC) antenna versus the conventional screen-printed on-substrate ones that have been used for the transfer of sensory data from a chip to a cell phone reader. Furthermore, the transferred power efficiency in a coupled NFC system is calculated for various chip coil geometries and the results are compared. The proposed NFC antenna was fabricated via a lithography process for an application-specific integrated circuit (ASIC) chip. The chip had a small area of 2.4 × 2.4 mm2, therefore a miniaturized NFC antenna was designed, whereas the screen-printed on-substrate antennas had an area of 35 × 51 mm2. This paper investigates the effects of different parameters such as conductor thickness and materials, double layering, and employing ferrite layers with different thicknesses on the performance of the on-chip antennas using full-wave simulations. The presence of a ferrite layer to increase the inductance of the antenna and mitigate the interactions with backplates has proven useful. The best performance was obtained via double-layering of the coils, which was similar to on-substrate antennas, while a size reduction of 99.68% was gained. Consequently, the coupling factors and maximum achievable power transmission efficiency of the on-chip antenna and on-substrate antenna were studied and compared.

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Section: Methodsmentioning

confidence: 99%

Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips

Kordzadeh

Holzmann

Binder

et al. 2020

IoT

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“…A possible solution to this is thermosonic fine‐pitch flip‐chip bonding, as demonstrated by Roshanghias et al. [ 16 ] Alternatively, anisotropic conductive films can be employed. As an example, Yoon et al.…”

Section: Introductionmentioning

confidence: 99%

“…Conventional soldering or thermocompression bonding methods are not applicable, due to the low-temperature tolerance of paper. A possible solution to this is thermosonic fine-pitch flipchip bonding, as demonstrated by Roshanghias et al [16] Alternatively, anisotropic conductive films can be employed. As an example, Yoon et al [17] reported on the reliability of the bonding of bare silicon dies with thicknesses of 30 μm and 730 μm to screen-printed paper and PET substrates.…”

Section: Introductionmentioning

confidence: 99%

Sustainable Multifunctional Biface Sensor Tag

Rauter

Zikulnig

Moldaschl

et al. 2023

Advanced Sensor Research

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In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a variety of applications. However, the adaptive design allows the integration of different sensors depending on the specific sensing task. The material consumption is minimized by double‐sided printing, resulting in compact, resource‐efficient sensor solutions. On one side, the tag is equipped with a printed antenna, a fully passive silicon‐based near‐field communication chip and a carbon‐based strain sensor, while the environmental sensors for humidity and temperature are printed on the other side. Due to its low cost, the usage of environmentally friendly materials and the absence of a battery, the biface sensor tag is a milestone in the field of wireless, sustainable electronics for ubiquitous sensing applications. The fabrication itself comprises a series of processes with a focus on efficient additive manufacturing. The characterization of the three sensors shows sensitivity values and characteristics comparable to those found in literature and industrially manufactured sensors. The utilization of a smartphone for reading out the sensor signals further emphasizes the sustainable approach of this sensor system.

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“…Usually, at this stage, some specific material needs to be applied at the bonding interface between the flexible paper substrate and the component to be bonded, to assist the mechanical and electrical performance reliability. For this purpose, a wide range of options are available, between isotropic or anisotropic conductive (ACP) and non-conductive adhesives (NCP), as either paste or film [22][23][24][25]. The issue with the use of this complementary bonding technique and assistive materials is the need to add an extra step and extra material in the roll-to-roll (R2R) or sheet-tosheet (S2S) assembling process line, possibly increasing cost and reducing throughput.…”

Section: Introductionmentioning

confidence: 99%

Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

Rodrigues

Weissbach

Malik

et al. 2022

J Mater Sci: Mater Electron

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Paper-based electronics is an emerging concept with the prospect of developing recyclable, low cost, flexible, and green products such as paper displays, smart labels, RFID tags, smart packages, electronic magazines, biological and medical devices. Compared to conventional printed circuit board (PCB) materials, utilizing paper as an electronics substrate has both physical and chemical challenges. Nowadays, the integration of components on papers are mainly conducted using adhesives [such as anisotropic conductive paste (ACP), isotropic conductive paste (ICP), and non-conductive pastes (NCP)] or low-temperature solders. The application of adhesives and solders in a roll-to-roll fabrication line of papers requires an additional dispensing or printing unit, which has its own drawbacks. Therefore, alternative approaches such as pre-applied adhesive films either on bare dies or papers can gain significant attention. In this study, by exploiting the unique properties of a paper coating material (i.e., polypropylene) as a non-conductive adhesive, it was shown that direct flip-chip bonding of the bare dies and devices could be successfully performed on paper without using any additional adhesives or solders. The electrical and mechanical performance of the flip chip-bonded dies on the polypropylene-coated paper substrate were assessed utilizing daisy-chain contact resistance measurement and die-shear analysis, respectively. Moreover, for an RFID tag application, RFID chips were flip chip bonded to the coated papers and functional tests via NFC communication were also successfully exerted. It was concluded that the polypropylene film on the paper can be considered as an intrinsic NCP layer for flip-chip integration of bare dies.

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Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates

Cited by 14 publications

References 11 publications

Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips

Miniaturized On-Chip NFC Antenna versus Screen-Printed Antenna for the Flexible Disposable Sensor Strips

Sustainable Multifunctional Biface Sensor Tag

Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

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