Thermosonic flip-chip bonding for an 8×8 VCSEL array

McLaren, T.; Kang, Sayoon; Zhang, Wenge; Hellman, D.; Ju, Teh-Hua; Lee, Y.C.

doi:10.1109/ectc.1995.515310

Cited by 9 publications

(5 citation statements)

References 8 publications

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“…For example, the effect of A1 to the system is obtained by averaging the results of simulation 1 to 9 as shown in Eq. (2). Simulation 1 to 9 is carried out under the condition of A1 (no straightness error).…”

Section: Effect Of the Design And Tolerance Parameters On The Performmentioning

confidence: 99%

“…Taguchi's method [2] is used to figure the effect of each parameter on the performance of the system. This method makes it possible to find not only the sensitivity of each parameter's error to the system but also the interaction of the parameters by the least number of analyses.…”

Section: Design and Tolerance Parametersmentioning

confidence: 99%

“…As semiconductor chips become miniaturized, flip chip bonding becomes the alternative solution for high performance packaging replacing the conventional soldering technology, because it is clear and cost effective [1], [2]. Flip chip assembly technology includes three major bonding techniques; thermocompression bonding, ultrasonic bonding and thermosonic bonding.…”

Section: Introductionmentioning

confidence: 99%

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Effect of the design and the tolerance parameters on the thermosonic transverse bonding flip chip system

2007

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Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this study, an endeavor has been made to design the horn and shank as an assembly. A commercial FEM software (ANSYS) is used to analyze the system. New design of the clamp to hold the horn at the nodal point is also introduced. The clamp with a bent shape is newly designed. It shows the ability to increase the amplitude of the vibration at the end of the horn compared with the straight-cylindrical-type-clamp.For the optimal design of the horn-shank assembly system, it is studied the effect of the design parameters and the tolerance on the vibration amplitude and planarity at the end of the shank. The variation of the design parameters and the tolerance changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The design and tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have great effect on the amplitude of the system.

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Section: Effect Of the Design And Tolerance Parameters On The Performmentioning

confidence: 99%

Section: Design and Tolerance Parametersmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effect of the design and the tolerance parameters on the thermosonic transverse bonding flip chip system

2007

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“…Solder self-alignment is a predominant technology for electronics assembly and packaging. It is not only used for electrical connections, but also for sub-micron accuracy alignment in many packaging applications [22]- [24]. In addition, a series of work has been done on flip chip bump height control [25], [26].…”

Section: A Flip Chip Packagingmentioning

confidence: 99%

The design and assembly of surface-micromachined optical switch for optical add/drop multiplexer application

Lin

Chiou

Lin

et al. 2003

IEEE Trans. Adv. Packag.

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An assembly process including: flip-chip bonding, microelectromechanical (MEMS) structure release, and atomic layer deposition (ALD) is proposed to integrate a surface micromachined optical switch for optical add/drop multiplexer (OADM) applications. In the current optical switch designs, pre-stressed beams were used to pop up the micromirror and an electrode (substrate) under the beams was designed to perform ON/OFF function of the optical switch. In order to achieve desired popped-up angle for precise optical switching, a flip-chip bonding technique is applied to a mechanical stopper with an accurate joint height that can be used to constrain the movement of the micromirror. A conformal thin layer of dielectric material (Al 2 O 3 ) coated on the surfaces of device through an ALD coating process is used to improve vertical actuation force, as well as electrical isolation. Experiments indicate that the micromirrors fabricated by the present assembly process can achieve desired angle that meet the requirements of the proposed OADM configuration.

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“…Ultrasonic welding and joining have been used successfully in many applications such as wire bonding, plastic joining and flip chip assembly [1,2]. In addition to low temperature process, it has numbers of merits compared to other bonding methods.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging

Kim

Chiao

Lin

Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical

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In this paper the feasibility of ultrasonic bonding for hermetic MEMS packaging has been demonstrated for the first time adopting two different sets of materials; indium-to-gold and aluminum-to-aluminum. The process utilizes purely mechanical vibration energy and enables low temperature bonding between similar or dissimilar materials without precleaning of the bonding surfaces. As such, ultrasonic bonding can be broadly applied not only for electrical interconnection, but also for hermetic MEMS sealing and packaging especially where temperature limitation is a critical issue. This paper describes the ultrasonic bonding and hermetic sealing processes as well as the bonding tool characterization and equipment setups.

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Thermosonic flip-chip bonding for an 8×8 VCSEL array

Cited by 9 publications

References 8 publications

Effect of the design and the tolerance parameters on the thermosonic transverse bonding flip chip system

Effect of the design and the tolerance parameters on the thermosonic transverse bonding flip chip system

The design and assembly of surface-micromachined optical switch for optical add/drop multiplexer application

Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging

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