2021
DOI: 10.1038/s42005-021-00680-7
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Thermosuperrepellency of a hot substrate caused by vapour percolation

Abstract: Drop rebound after collision with a very hot substrate is usually attributed to the Leidenfrost effect, characterized by intensive film boiling in a thin vapour gap between the liquid and substrate. Similarly, drop impact onto a cold superhydrophobic substrate leads to a complete drop rebound, despite partial wetting of the substrate. Here we study the repellent properties of hot smooth hydrophilic substrates in the nucleate boiling, non-Leidenfrost regime and discover that the thermally induced repellency is … Show more

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Cited by 12 publications
(10 citation statements)
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References 35 publications
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“…The occurrence of large vapour clusters can be described by the percolation of single bubbles within the lamella, as shown in Fig. 14c and described in [25]. The remaining wetted area, which is not covered by vapour, is described by c ≈ 0.32.…”
Section: Thermosuperrepellencymentioning
confidence: 93%
“…The occurrence of large vapour clusters can be described by the percolation of single bubbles within the lamella, as shown in Fig. 14c and described in [25]. The remaining wetted area, which is not covered by vapour, is described by c ≈ 0.32.…”
Section: Thermosuperrepellencymentioning
confidence: 93%
“…The accompanied phenomena, often wrongly associated with the film boiling regime, are described in detail in the recent experimental and theoretical study. 17 This regime includes some phenomena typical to the nucleate boiling regime and to the film boiling regime. It is characterized by the drop rebound.…”
Section: Higher Wall Temperatures: Film Boiling and Thermal Atomizationmentioning
confidence: 99%
“…Comparison of the drop spreading time and the time required for bubble percolation, leading to the formation of the vapor channels at the substrate surface, allows to estimate the temperature at which the drop rebounds from the substrate after its spreading and receding. 17 The estimated temperatures for the drop rebound…”
Section: Higher Wall Temperatures: Film Boiling and Thermal Atomizationmentioning
confidence: 99%
See 1 more Smart Citation
“…The novel insight gained is related to the importance of the substrate material, in particular the thermal effusivity of the substrate. The heat transfer at these high temperatures is strongly a conjugate heat transfer problem; hence, the rate at which the thermal boundary in the substrate develops becomes an important factor in defining this point [50].…”
Section: Droplet and Spray Interactions With Hot Wallsmentioning
confidence: 99%