2010
DOI: 10.4028/www.scientific.net/amr.105-106.301
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Thick Film Metallization of AlN by Reactive Binders

Abstract: The thick-film metallization of AlN has received considerable attention because of its potential applications in electronic packaging. Here we reported on the thick film metallization of AlN by reactive binders. The metallization paste of Ag was prepared with organic vehicle of castor oil, ethyl cellulose and beta-terpineol and reactive binders of TiB2 and Co3O4. The control of the paste viscosity was discussed by changing the dispersant content. Meanwhile effects of the components and sintering process on the… Show more

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Cited by 2 publications
(2 citation statements)
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“…Si [34] 800 °C/10 min 2.00 --AlN [35] 850 °C/10 min -4.00 11.7 Si [36] 800 °C/10 min -5.90 -AlN [37] 850 °C/15 min -5.30 12.7 AlN [33] 850 °C/10 min -0.93 6.7 Al 2 O 3 [28] 600 °C/15 min 2.50 -28.5 Al 2 O 3 [38] 850 °C/10 min 2.87 -14.6 AlN [16] 850 °C/15 min -0. 9, in which obvious cracks are visible at the interface between the silver layer and MgTiO 3 ceramic substrate.…”
Section: Substratementioning
confidence: 99%
“…Si [34] 800 °C/10 min 2.00 --AlN [35] 850 °C/10 min -4.00 11.7 Si [36] 800 °C/10 min -5.90 -AlN [37] 850 °C/15 min -5.30 12.7 AlN [33] 850 °C/10 min -0.93 6.7 Al 2 O 3 [28] 600 °C/15 min 2.50 -28.5 Al 2 O 3 [38] 850 °C/10 min 2.87 -14.6 AlN [16] 850 °C/15 min -0. 9, in which obvious cracks are visible at the interface between the silver layer and MgTiO 3 ceramic substrate.…”
Section: Substratementioning
confidence: 99%
“…The shearing strength of silver paste on the LTCC substrate was 19.66 ± 4.05 MPa which was similar to that of other silver paste on the ceramic substrate. [35,36]…”
Section: Mechanical Propertiesmentioning
confidence: 99%