Thickness dependent critical strain in submicron Cu films adherent to polymer substrate

Niu, Rong; Liu, G.; Wang, C.; Zhang, G.; Ding, Xiangdong; Sun, Jun

doi:10.1063/1.2722684

Cited by 110 publications

(89 citation statements)

References 19 publications

(10 reference statements)

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“…The large rupture strains of metal films bonded to polyimide substrates have been demonstrated in experiments [6,7] and in simulations [10,17] . It has been reported that 340-or 700-nm-thick well-bonded Cu films can remain the majority intact with strains up to 20%, except for isolated short cracks [7] , as seen in Figure 1.…”

Section: Substrates-bonded Filmsmentioning

confidence: 95%

“…Flexible electronics are mostly made of electronic thin films (metals, dielectrics and semiconductors) on compliant substrates. For example, in flexible electronics design, metal thin films of Cu deposited on polyimide (PI) are commonly used as electrodes or interconnects [6,7] . During manufacture and services, flexible electronic devices will be subject to large, repeated deformation.…”

Section: Thin Films Deformation Flexible Electronicsmentioning

confidence: 99%

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Ductility of metal thin films in flexible electronics

Niu

Liu

Ding

et al. 2008

Sci. China Ser. E-Technol. Sci.

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Flexible, large area electronics using various organic and inorganic materials are beginning to show great promise. During manufacture and service, large deformation of these hybrid materials will pose significant challenges in terms of high performance and reliability. A deep understanding of the ductility or flexibility of macroelectronics becomes one of the major issues that must be addressed urgently. This paper describes the current level of understanding on the thin-film ductility, both free-standing and substrate-supported, and relevant influencing factors. thin films, deformation, flexible electronicsIn recent years, remarkable progress on enlarging system scale has given rise to a nascent field known as macroelectronics [1,2] . The most visible example of macroelectronics at present is flat-panel displays, which have been rapidly replacing cathode-ray tubes as the monitors of choice for computers and televisions since 2000. The commercial success of flat-panel display opens an era of large area electronics, and other emerging applications, such as rollable display [3] , printable thin-film solar cell [4] and electronic skin [5] , demonstrate further desirable attributes for macroelectronic systems, including flexibility, portability and low-cost. Accordingly, a growing trend is to fabricate macroelectronic products directly on flexible substrates, such as polymers. The flat-panel displays made on thin polymer substrates are rugged, lightweight and can be rolled upthey will be portable. For example, the world's first prototype of a rollable electronic reader, which can unfold to a 5-inch display and roll back into a pocket-size (100 mm×60 mm×20 mm) device. Flexible electronics have the opportunity not only to revolutionize an industry but also to create entirely new ones [1] .Notwithstanding the advances in device performance, there are traditional materials challenges in the enabling structures that must be addressed. Flexible electronics are mostly made of electronic thin films (metals, dielectrics and semiconductors) on compliant substrates. For example, in

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Section: Substrates-bonded Filmsmentioning

confidence: 95%

Section: Thin Films Deformation Flexible Electronicsmentioning

confidence: 99%

Ductility of metal thin films in flexible electronics

Niu

Liu

Ding

et al. 2008

Sci. China Ser. E-Technol. Sci.

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“…The critical strain is defined as the strain for crack initiation or necking, corresponding to the beginning of damage and weakening in service performance [17,30]. By contrast, the fracture strain is defined as the strain when cracks traverse the entire gauge width of the specimen or the electrical conductivity of the film is lost completely.…”

Section: Ductility Of Pi-supported Cu Filmsmentioning

confidence: 99%

“…Existing finite element simulations have shown that a metal film with adequate interfacial adhesion strength could deform uniformly up to a large strain, which is only limited by the rupture of the polymer substrate [11,12]. Experimentally, however, the elongation of most polymer-supported metal films are less than 20% [13][14][15][16][17][18]. The discrepancy between experiments and theory may be attributed to the difference in interfacial adhesion.…”

Section: Introductionmentioning

confidence: 97%

Ductility of copper films on sandblasting polyimide substrates

Yang

Fei

et al. 2010

Sci. China Technol. Sci.

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Different surface morphologies of polyimide (PI) foils widely applied in flexible electronics were obtained using the technique of sandblasting. Copper (Cu) films were subsequently deposited on the treated surface of PI substrates. Upon tensile loading, the critical strain, crack density and count of cracks were measured to examine the ductility of Cu films on PI substrates. Obtained results show that after sandblasting treatment, the critical strain of Cu film decreases from 8.0% to 6.9% and, in comparison with the case without sandblasting, its surface crack density decreases remarkably, with no saturation of the crack density. The reduced crack density is attributed to the increase of contact area and interfacial adhesion after sandblasting, and whether the crack density is saturated or not is dependent upon the morphology of the cracks formed as a function of tensile strain.

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“…For macro-scale materials, considerable research (3)- (10) has been conducted on deformation and fracture near an interface edge. On the other hand, nanometer-scale materials show a peculiar mechanical behavior different from that of the macro-scale (11)- (13) . For example, it is well known that the size of a material strongly affects the yield stress and the elasto-plastic constitutive equation.…”

Section: Introductionmentioning

confidence: 99%

Development of in-situ TEM Observation Method on Plasticity in Nanoscale Component

Sumigawa

Kitagawa

Kitamura

2011

JMMP

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In order to specify the plasticity of a nanoscale Cu component, we develop a novel experimental method by means of a general-purpose transmission electron microscopy (TEM). The characteristic shape of a designed thin specimen, where a Cu film with the thickness of 200 nm is sandwiched by rigid materials (Si substrate and SiN layer), enables us to apply a load near Cu/Si interface edge by an indenter, and prevents buckling due to compressive stress. Continuous in-situ TEM images of the Cu film during deformation are successfully obtained, and the generation and expansion of local plastic region of 10 nm-30 nm are recognized near the Cu/Si interface edge. The yield stress of the plastic region is approximately evaluated to be 200 MPa -400 MPa, which is close to the one obtained by an inverse analysis under a continuum assumption (272 MPa).

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Thickness dependent critical strain in submicron Cu films adherent to polymer substrate

Cited by 110 publications

References 19 publications

Ductility of metal thin films in flexible electronics

Ductility of metal thin films in flexible electronics

Ductility of copper films on sandblasting polyimide substrates

Development of in-situ TEM Observation Method on Plasticity in Nanoscale Component

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