2017
DOI: 10.1002/crat.201700178
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Thickness‐Dependent Tensile and Fatigue Behavior of A Single‐Slip‐Oriented Cu Single Crystal

Abstract: To explore the micro-mechanism for the size effect of the mechanical behavior of metallic crystals, the tensile and fatigue behavior of [345] Cu single crystal with t of 0.1−2.0 mm is investigated. The results show that with the reduction of t, an obvious increase in σ YS and a slight decrease in σ UTS take place; meanwhile, the δ evidently reduces, especially as t < 0.6 mm, while the N f first sharply increases and then decreases at a constant stress amplitude of 80 MPa. The activated slip system reduces with… Show more

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Cited by 8 publications
(2 citation statements)
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“…The orientation and deformation behavior of individual grains is particularly important due to the weak intergranular constraint. The specimen thickness [33] and grain orientation [34] are the key factors affecting the flow stress. In this case, the flow stress of the sheet is more difficult to predict due to the different orientation of individual grains.…”
Section: Discussionmentioning
confidence: 99%
“…The orientation and deformation behavior of individual grains is particularly important due to the weak intergranular constraint. The specimen thickness [33] and grain orientation [34] are the key factors affecting the flow stress. In this case, the flow stress of the sheet is more difficult to predict due to the different orientation of individual grains.…”
Section: Discussionmentioning
confidence: 99%
“…Accordingly, the size effect becomes more significant for Cu-Mn alloys. In contrast, the thicker specimen can help decentralize the stress localization due to the improvement of the mobile dislocations [20,21]. It is worth noticing that, compared with wavy-slip dislocation structures, planar slip structures can suppress the annihilation of dislocations and assist the strain-hardening process by reducing the dislocation glide length, leading to the enhancement in plastic defomation capacity [17][18][19].…”
Section: Solid State Phenomena Vol 294mentioning
confidence: 99%