Thin-Film Capacitor Technology for Improving Broadband Power Integrity

Kuhn, W.B.; Fund, Andrew D.; Wolf, J.; Schwartz, Robert W.; Claypool, James B.; O’Keefe, Matthew J.; Huebner, Wayne

doi:10.1109/tcpmt.2019.2901569

Cited by 2 publications

(1 citation statement)

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“…In contrast to commercial microwave monolithic capacitors and inductors based on CMOS, low temperature cofired ceramic (LTCC), or integrated passive device (IPD) processes on rigid substrates [25][26][27], flexible microwave passive components need to operate under mechanical bending conditions. Specifically, bending deformations have non-negligible impacts on the characteristics of microwave passive components, and their influence is related to the component dimensions, materials, etc.…”

Section: Introductionmentioning

confidence: 99%

On the operating mechanisms of flexible microwave inductors and capacitors under mechanical bending conditions

Yang¹,

Lan²,

You³

et al. 2021

J. Phys. D: Appl. Phys.

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Flexible microwave passive components play an important role in flexible integrated circuits, especially for high-speed wireless communication systems. It is clear that bending can have a significant impact on the flexible components' performance. However, an analysis of the physical mechanisms of flexible microwave passive components under mechanical bending conditions has not been completed. In this paper, we describe a study of the performance variations and operating mechanisms of flexible microwave inductors and capacitors under mechanical bending conditions. Flexible spiral inductors and metal-insulator-metal capacitors of various dimensions were fabricated on plastic substrates and measured under different mechanical bending conditions. Modeling of the flexible components was conducted. The influence of mechanical bending on flexible inductors and capacitors was characterized based on experimental and modeled results. The underlying operational mechanisms of flexible inductors and capacitors under bending conditions are discussed using the distributions of the electric and magnetic fields from the model. In addition, the performance variations with different component parameters (e.g. the metal and substrate materials, the thicknesses of the metals and dielectrics) were studied under bending conditions. The results are helpful for the use of flexible microwave passive components in flexible microwave monolithic integrated circuits.

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Section: Introductionmentioning

confidence: 99%