2018
DOI: 10.1109/led.2018.2868176
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Thin-Film Heterojunction FETs on Poly-Si Substrates for High-Stability Driving and Low-Power Amplification

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Cited by 3 publications
(11 citation statements)
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“…The amplifier gain and therefore power consumption are expected to improve with the optimization of the integration process. Given the high stability of the HJFETs [10], [11], the amplifier gain is expected to be sufficiently stable over time. We believe integration of additional circuitry (such as a comparator, or sample and hold) for a monolithic random number generator is also feasible with HJFETs.…”
Section: Resultsmentioning
confidence: 99%
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“…The amplifier gain and therefore power consumption are expected to improve with the optimization of the integration process. Given the high stability of the HJFETs [10], [11], the amplifier gain is expected to be sufficiently stable over time. We believe integration of additional circuitry (such as a comparator, or sample and hold) for a monolithic random number generator is also feasible with HJFETs.…”
Section: Resultsmentioning
confidence: 99%
“…The a-Si:H and hydrogenated crystalline Si (c-Si:H) layers are grown by plasma-enhanced chemical vapor deposition (PECVD) at ∼200 • C. Despite the low process temperature, HJFETs have a high electrical stability due to the high quality of the a-Si:H/ c-Si interface. HJFETs may also be fabricated on poly-Si substrates [11]. If poly-Si is prepared by pulsed laser crystallization, HJFETs are expected to be compatible with flexible plastic substrates.…”
Section: Device Characteristicsmentioning
confidence: 99%
“…The a-Si:H and c-Si:H layers are grown in the same PECVD reactor at 200 • C. The c-Si:H layer has a resistivity of ∼5×10 −4 .cm. The ∼50 nm-thick etch-stop oxide layer is also grown by PECVD at ∼200 • C. Further details regarding the fabrication process are available in [4].…”
Section: Device Characteristicsmentioning
confidence: 99%
“…The gate and source/drain regions of the HJFETs are formed by low-temperature (∼200 • C) plasma-enhanced chemical vapor deposition (PECVD) of a-Si:H and hydrogenated crystalline Si (c-Si:H), respectively. The c-Si substrate may be polycrystalline [4], in which case the c-Si:H source/drain regions are also polycrystalline, due to the epitaxial growth of c-Si:H [5], [6]. Provided that the starting poly-Si substrates are also prepared by a low-temperature technique, such as excimer laser annealing (ELA) of doped a-Si:H, the HJFET process is compatible with low-cost flexible plastic substrates.…”
Section: Introductionmentioning
confidence: 99%
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