Thin film integration of passives - single components, filters, integrated passive devices

Abstract

The increasing demands on future electronic products require more efficient system integration technologies. Especially the package density gap at board level with the high integrated circuits (ICs) on the one hand and the discrete passive components on the other has to be closed by new packaging technologies which integrate the passive components into the substrate, an interposer or the IC itself. This paper presents investigations for the common integration of inductors, resistors, capacitors as well as passive filter structures in a thin film build up, based on copper and benzocyclobutene (BCB). Technologies from wafer level packaging were adapted for manufacturing of the integrated components. The examinations were carried out with special focus on integrated coils and passive filter structures. Build up, design, processing as well as results of the electrical characterization of the integrated components are described in detail. Furthermore, an integrated passive device (IPD) for application as a filter element in the Bluetooth band is presente

Copper / Benzocyclobutene Multi Layer Wiring - A flexible base Technology for Wafer Level Integration of passive Components

“…Because of its low dielectric loss, BCB has already proven to be well suitable for the production of high quality capacitors and high performance RF substrates. [12,14] Figure 5 shows a microscopic image as well as a microscopic image of a cross sectional view of a capacitor with BCB as dielectric. The layer numbers, which are written in the picture of the cross sectional view correspond with the layer numbering in Figure 1.…”

“…In case of using silicon as substrate quality factors decline due to substrate losses. [6,12] In case of the resistors straight and meandered forms with resistance values between 100 Ohm and 150 kOhm have been realized by using typical line width between 20 µm und 80 µm. The resistors are based on a sheet resistance of the NiCr layer of 100 Ohm per square.…”

Synthesis of Triple-Band and Quad-Band Bandpass Filters Using Lumped-Element Coplanar Waveguide Resonators

“…Compared with the waveguide filters in RF front-end module [4,5], the essential multi-passband filter fabricated in printed circuit board technology provides the best candidate for multi-mode wireless mobile system due to its low profile, low cost and easy interconnection with other components. Moreover, the passive devices using lumped elements can be realized by advanced fabrication process, such as low temperature co-fired ceramic [6] and integrated passive device [7,8], and thus play a vital role in the development of highly integrated RF front-end module.…”

Electrical simulation of thin film inductors on silicon and glass substrates

“…Although the using of silicon substrates can solve most of these issues, silicon has shortcomings such as high electrical loss and high cost. While glass substrate is a good candidate for short interconnects and high wiring density [1]. As compared with silicon, glass substrate has great advantage in high frequency range due to its low loss property.…”

“…Especially products in the "hand held" as well as in the "high performance" sector are indicated to be affected by these disadvantages. Thus these products are the driving force for new technologies overcoming the drawbacks of discrete passives [1]. For further miniaturization and highdensity growth, it is necessary to integrate passive components into thin film multi layer systems.…”