“…Along with the low-cost miniaturization trend as well as the need in increasing operation frequency of modern communication systems, acoustoelectric bulk acoustic wave (BAW) devices with improved insertion loss, temperature stability, power handling capability, electrostatic discharge protection, selectivity and mechanical quality factor, are very likely to take the place of discrete SAW components, particularly represented by the breakthrough in miniaturization of frequency-selective devices brought from thin-film bulk acoustic resonator (which is bulk micromachined, offering excellent temperature stability), solidly mounted resonator and high overtone bulk acoustic resonator technology. Many reviews are available on technology and devices of SAW and BAW, including design process, modeling, fabrication, as well as marketing application [512,513,514,515], etc .…”